| contributor author | J. M. Hu | |
| contributor author | D. Barker | |
| contributor author | R. Ghoshtagore | |
| contributor author | M. Pecht | |
| date accessioned | 2017-05-08T23:43:57Z | |
| date available | 2017-05-08T23:43:57Z | |
| date copyright | June, 1994 | |
| date issued | 1994 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26142#148_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/113450 | |
| description abstract | Thermomechanical properties of low temperature cofired ceramic substrates in the range of operational temperatures are necessary to incorporate into the design models for multichip modules and other electronic packages. These properties are also required in assessing reliability and aiding in screening and qualification procedures. This paper presents the test methods and experimental results on various thermomechanical properties of low temperature cofired ceramic over the the temperature range of −55°C to +250°C. Material properties determined from the tests include the modulus of elasticity, the modulus of rupture, the fracture toughness, and the coefficient of thermal expansion. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Investigation of Thermomechanical Properties of Low Temperature Cofired Ceramic | |
| type | Journal Paper | |
| journal volume | 116 | |
| journal issue | 2 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.2905503 | |
| journal fristpage | 148 | |
| journal lastpage | 153 | |
| identifier eissn | 1043-7398 | |
| keywords | Ceramics | |
| keywords | Low temperature | |
| keywords | Temperature | |
| keywords | Thermal expansion | |
| keywords | Elasticity | |
| keywords | Fracture toughness | |
| keywords | Rupture | |
| keywords | Electronic packages | |
| keywords | Multi-chip modules | |
| keywords | Reliability | |
| keywords | Materials properties AND Design | |
| tree | Journal of Electronic Packaging:;1994:;volume( 116 ):;issue: 002 | |
| contenttype | Fulltext | |