Thermal Fatigue Damage in the Solder Joints of Leadless Chip Resistors

Abstract

Leadless chip resistors (LCR) made by two different manufacturers and surface mounted on glass/epoxy printed circuit board (PCB) were subjected to thermal cycling between −55°C to 125°C in order to induce thermal fatigue failure/damage. The test units were subjected to a maximum of 250 thermal cycles. Solder joints in both types of LCRs were examined in scanning electron microscope and a relative comparison of the extent of fatigue damage is presented. The failure mechanism is associated with cracking in the eutectic compostion Sn/Pb solder initiated at the stress concentration sites. A nonlinear, time-dependent finite element modeling analysis has been performed to determine critical stress concentration sites in the solder joint. Key parameters leading to the initiation of solder damage are identified, and recommendations are made to improve the design in terms of solder configuration such as the radius of corner of the alumina substrate and the standoff height.