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    A Solution Methodology for the Multiple Batch Surface Mount PCB Placement Sequence Problem

    Source: Journal of Electronic Packaging:;1994:;volume( 116 ):;issue: 004::page 282
    Author:
    Yu-Wen Huang
    ,
    Jim Adriance
    ,
    George Westby
    ,
    K. Srihari
    DOI: 10.1115/1.2905699
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The placement of surface mount components is a time consuming and critical task in the assembly of surface mount Printed Circuit Boards (PCBs). The focus of this research was the identification of “near optimal” solutions for the placement sequence identification problem. The factors considered include the placement machine and the specific PCB, the feeder space available, the need for tooling and nozzle changes, and the actual traveling path of the placement head. Expert (or knowledge based) systems were used as the solution method for this problem. The system developed can cope with single PCBs, panels, 180 deg offset boards (panels), and multiple PCB batches. The prototype knowledge based system developed in this research identifies solutions in (almost) realtime.
    keyword(s): Surface mount packaging , Surface mount components , Machinery , Manufacturing , Lumber , Engineering prototypes , Nozzles , Tooling , Travel AND Printed circuit boards ,
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      A Solution Methodology for the Multiple Batch Surface Mount PCB Placement Sequence Problem

    URI
    http://yetl.yabesh.ir/yetl1/handle/yetl/113416
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    • Journal of Electronic Packaging

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    contributor authorYu-Wen Huang
    contributor authorJim Adriance
    contributor authorGeorge Westby
    contributor authorK. Srihari
    date accessioned2017-05-08T23:43:53Z
    date available2017-05-08T23:43:53Z
    date copyrightDecember, 1994
    date issued1994
    identifier issn1528-9044
    identifier otherJEPAE4-26146#282_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/113416
    description abstractThe placement of surface mount components is a time consuming and critical task in the assembly of surface mount Printed Circuit Boards (PCBs). The focus of this research was the identification of “near optimal” solutions for the placement sequence identification problem. The factors considered include the placement machine and the specific PCB, the feeder space available, the need for tooling and nozzle changes, and the actual traveling path of the placement head. Expert (or knowledge based) systems were used as the solution method for this problem. The system developed can cope with single PCBs, panels, 180 deg offset boards (panels), and multiple PCB batches. The prototype knowledge based system developed in this research identifies solutions in (almost) realtime.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleA Solution Methodology for the Multiple Batch Surface Mount PCB Placement Sequence Problem
    typeJournal Paper
    journal volume116
    journal issue4
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.2905699
    journal fristpage282
    journal lastpage289
    identifier eissn1043-7398
    keywordsSurface mount packaging
    keywordsSurface mount components
    keywordsMachinery
    keywordsManufacturing
    keywordsLumber
    keywordsEngineering prototypes
    keywordsNozzles
    keywordsTooling
    keywordsTravel AND Printed circuit boards
    treeJournal of Electronic Packaging:;1994:;volume( 116 ):;issue: 004
    contenttypeFulltext
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian