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contributor authorYu-Wen Huang
contributor authorJim Adriance
contributor authorGeorge Westby
contributor authorK. Srihari
date accessioned2017-05-08T23:43:53Z
date available2017-05-08T23:43:53Z
date copyrightDecember, 1994
date issued1994
identifier issn1528-9044
identifier otherJEPAE4-26146#282_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/113416
description abstractThe placement of surface mount components is a time consuming and critical task in the assembly of surface mount Printed Circuit Boards (PCBs). The focus of this research was the identification of “near optimal” solutions for the placement sequence identification problem. The factors considered include the placement machine and the specific PCB, the feeder space available, the need for tooling and nozzle changes, and the actual traveling path of the placement head. Expert (or knowledge based) systems were used as the solution method for this problem. The system developed can cope with single PCBs, panels, 180 deg offset boards (panels), and multiple PCB batches. The prototype knowledge based system developed in this research identifies solutions in (almost) realtime.
publisherThe American Society of Mechanical Engineers (ASME)
titleA Solution Methodology for the Multiple Batch Surface Mount PCB Placement Sequence Problem
typeJournal Paper
journal volume116
journal issue4
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.2905699
journal fristpage282
journal lastpage289
identifier eissn1043-7398
keywordsSurface mount packaging
keywordsSurface mount components
keywordsMachinery
keywordsManufacturing
keywordsLumber
keywordsEngineering prototypes
keywordsNozzles
keywordsTooling
keywordsTravel AND Printed circuit boards
treeJournal of Electronic Packaging:;1994:;volume( 116 ):;issue: 004
contenttypeFulltext


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