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    Finite Element Method for Predicting Equilibrium Shapes of Solder Joints

    Source: Journal of Electronic Packaging:;1993:;volume( 115 ):;issue: 002::page 141
    Author:
    N. J. Nigro
    ,
    S. M. Heinrich
    ,
    A. F. Elkouh
    ,
    Ping S. Lee
    ,
    X. Zou
    ,
    R. Fournelle
    DOI: 10.1115/1.2909309
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: This paper discusses the development and application of a finite element method for determining the equilibrium shapes of solder joints which are formed during a surface mount reflow process. The potential energy governing the joint formation problem is developed in the form of integrals over the joint surface, which is discretized with the use of finite elements. The spatial variables which define the shape of the surface are expressed in a parametric form involving products of interpolation (blending) functions and element nodal coordinates. The nodal coordinates are determined by employing the minimum potential energy theorem. The method described in this paper is very general and can be employed for those problems involving the formation of three dimensional joints with complex shapes. It is well suited for problems in which the boundary region is not known a priori (e.g., “infinite tinning” problems). Moreover, it enables the user to determine the shape of the joint in parametric form which facilitates meshing for subsequent finite element stress and thermal analyses.
    keyword(s): Equilibrium (Physics) , Finite element methods , Shapes , Solder joints , Finite element analysis , Potential energy , Stress , Theorems (Mathematics) , Functions , Interpolation , Thermal analysis AND Surface mount packaging ,
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      Finite Element Method for Predicting Equilibrium Shapes of Solder Joints

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    http://yetl.yabesh.ir/yetl1/handle/yetl/111769
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    contributor authorN. J. Nigro
    contributor authorS. M. Heinrich
    contributor authorA. F. Elkouh
    contributor authorPing S. Lee
    contributor authorX. Zou
    contributor authorR. Fournelle
    date accessioned2017-05-08T23:41:01Z
    date available2017-05-08T23:41:01Z
    date copyrightJune, 1993
    date issued1993
    identifier issn1528-9044
    identifier otherJEPAE4-26137#141_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/111769
    description abstractThis paper discusses the development and application of a finite element method for determining the equilibrium shapes of solder joints which are formed during a surface mount reflow process. The potential energy governing the joint formation problem is developed in the form of integrals over the joint surface, which is discretized with the use of finite elements. The spatial variables which define the shape of the surface are expressed in a parametric form involving products of interpolation (blending) functions and element nodal coordinates. The nodal coordinates are determined by employing the minimum potential energy theorem. The method described in this paper is very general and can be employed for those problems involving the formation of three dimensional joints with complex shapes. It is well suited for problems in which the boundary region is not known a priori (e.g., “infinite tinning” problems). Moreover, it enables the user to determine the shape of the joint in parametric form which facilitates meshing for subsequent finite element stress and thermal analyses.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleFinite Element Method for Predicting Equilibrium Shapes of Solder Joints
    typeJournal Paper
    journal volume115
    journal issue2
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.2909309
    journal fristpage141
    journal lastpage146
    identifier eissn1043-7398
    keywordsEquilibrium (Physics)
    keywordsFinite element methods
    keywordsShapes
    keywordsSolder joints
    keywordsFinite element analysis
    keywordsPotential energy
    keywordsStress
    keywordsTheorems (Mathematics)
    keywordsFunctions
    keywordsInterpolation
    keywordsThermal analysis AND Surface mount packaging
    treeJournal of Electronic Packaging:;1993:;volume( 115 ):;issue: 002
    contenttypeFulltext
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian