Show simple item record

contributor authorN. J. Nigro
contributor authorS. M. Heinrich
contributor authorA. F. Elkouh
contributor authorPing S. Lee
contributor authorX. Zou
contributor authorR. Fournelle
date accessioned2017-05-08T23:41:01Z
date available2017-05-08T23:41:01Z
date copyrightJune, 1993
date issued1993
identifier issn1528-9044
identifier otherJEPAE4-26137#141_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/111769
description abstractThis paper discusses the development and application of a finite element method for determining the equilibrium shapes of solder joints which are formed during a surface mount reflow process. The potential energy governing the joint formation problem is developed in the form of integrals over the joint surface, which is discretized with the use of finite elements. The spatial variables which define the shape of the surface are expressed in a parametric form involving products of interpolation (blending) functions and element nodal coordinates. The nodal coordinates are determined by employing the minimum potential energy theorem. The method described in this paper is very general and can be employed for those problems involving the formation of three dimensional joints with complex shapes. It is well suited for problems in which the boundary region is not known a priori (e.g., “infinite tinning” problems). Moreover, it enables the user to determine the shape of the joint in parametric form which facilitates meshing for subsequent finite element stress and thermal analyses.
publisherThe American Society of Mechanical Engineers (ASME)
titleFinite Element Method for Predicting Equilibrium Shapes of Solder Joints
typeJournal Paper
journal volume115
journal issue2
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.2909309
journal fristpage141
journal lastpage146
identifier eissn1043-7398
keywordsEquilibrium (Physics)
keywordsFinite element methods
keywordsShapes
keywordsSolder joints
keywordsFinite element analysis
keywordsPotential energy
keywordsStress
keywordsTheorems (Mathematics)
keywordsFunctions
keywordsInterpolation
keywordsThermal analysis AND Surface mount packaging
treeJournal of Electronic Packaging:;1993:;volume( 115 ):;issue: 002
contenttypeFulltext


Files in this item

Thumbnail

This item appears in the following Collection(s)

Show simple item record