contributor author | Ling Yan | |
contributor author | J. V. Beck | |
contributor author | A. Haji-Sheikh | |
date accessioned | 2017-05-08T23:41:00Z | |
date available | 2017-05-08T23:41:00Z | |
date copyright | September, 1993 | |
date issued | 1993 | |
identifier issn | 1528-9044 | |
identifier other | JEPAE4-26139#276_1.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/111758 | |
description abstract | Exact series solutions for three-dimensional temperature distribution in two-layer bodies subject to various types of boundary conditions are presented. Special consideration is given to the case when one layer is a thin diamond film. The computation emphasizes the temperature effect of an embedded thin heat source of the type used in electronic devices. The mathematical formulation employs the Green’s function solution method. The solution is time partitioned in order to achieve a high degree of accuracy. Time partitioning greatly improves the convergence of three-dimensional heat conduction solutions. Time-partitioned series solutions with a reduced number of terms yield highly accurate temperature data. A two-layer model is chosen for simplicity of presentation; however, the method can be extended to more than two layers. | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | Thermal Characteristics of Two-Layered Bodies With Embedded Thin-Film Heat Source | |
type | Journal Paper | |
journal volume | 115 | |
journal issue | 3 | |
journal title | Journal of Electronic Packaging | |
identifier doi | 10.1115/1.2909329 | |
journal fristpage | 276 | |
journal lastpage | 283 | |
identifier eissn | 1043-7398 | |
keywords | Thin films | |
keywords | Heat | |
keywords | Temperature | |
keywords | Heat conduction | |
keywords | Diamond films | |
keywords | Boundary-value problems | |
keywords | Computation AND Temperature distribution | |
tree | Journal of Electronic Packaging:;1993:;volume( 115 ):;issue: 003 | |
contenttype | Fulltext | |