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    Thermal Characteristics of Two-Layered Bodies With Embedded Thin-Film Heat Source

    Source: Journal of Electronic Packaging:;1993:;volume( 115 ):;issue: 003::page 276
    Author:
    Ling Yan
    ,
    J. V. Beck
    ,
    A. Haji-Sheikh
    DOI: 10.1115/1.2909329
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Exact series solutions for three-dimensional temperature distribution in two-layer bodies subject to various types of boundary conditions are presented. Special consideration is given to the case when one layer is a thin diamond film. The computation emphasizes the temperature effect of an embedded thin heat source of the type used in electronic devices. The mathematical formulation employs the Green’s function solution method. The solution is time partitioned in order to achieve a high degree of accuracy. Time partitioning greatly improves the convergence of three-dimensional heat conduction solutions. Time-partitioned series solutions with a reduced number of terms yield highly accurate temperature data. A two-layer model is chosen for simplicity of presentation; however, the method can be extended to more than two layers.
    keyword(s): Thin films , Heat , Temperature , Heat conduction , Diamond films , Boundary-value problems , Computation AND Temperature distribution ,
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      Thermal Characteristics of Two-Layered Bodies With Embedded Thin-Film Heat Source

    URI
    http://yetl.yabesh.ir/yetl1/handle/yetl/111758
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    • Journal of Electronic Packaging

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    contributor authorLing Yan
    contributor authorJ. V. Beck
    contributor authorA. Haji-Sheikh
    date accessioned2017-05-08T23:41:00Z
    date available2017-05-08T23:41:00Z
    date copyrightSeptember, 1993
    date issued1993
    identifier issn1528-9044
    identifier otherJEPAE4-26139#276_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/111758
    description abstractExact series solutions for three-dimensional temperature distribution in two-layer bodies subject to various types of boundary conditions are presented. Special consideration is given to the case when one layer is a thin diamond film. The computation emphasizes the temperature effect of an embedded thin heat source of the type used in electronic devices. The mathematical formulation employs the Green’s function solution method. The solution is time partitioned in order to achieve a high degree of accuracy. Time partitioning greatly improves the convergence of three-dimensional heat conduction solutions. Time-partitioned series solutions with a reduced number of terms yield highly accurate temperature data. A two-layer model is chosen for simplicity of presentation; however, the method can be extended to more than two layers.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleThermal Characteristics of Two-Layered Bodies With Embedded Thin-Film Heat Source
    typeJournal Paper
    journal volume115
    journal issue3
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.2909329
    journal fristpage276
    journal lastpage283
    identifier eissn1043-7398
    keywordsThin films
    keywordsHeat
    keywordsTemperature
    keywordsHeat conduction
    keywordsDiamond films
    keywordsBoundary-value problems
    keywordsComputation AND Temperature distribution
    treeJournal of Electronic Packaging:;1993:;volume( 115 ):;issue: 003
    contenttypeFulltext
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