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contributor authorLing Yan
contributor authorJ. V. Beck
contributor authorA. Haji-Sheikh
date accessioned2017-05-08T23:41:00Z
date available2017-05-08T23:41:00Z
date copyrightSeptember, 1993
date issued1993
identifier issn1528-9044
identifier otherJEPAE4-26139#276_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/111758
description abstractExact series solutions for three-dimensional temperature distribution in two-layer bodies subject to various types of boundary conditions are presented. Special consideration is given to the case when one layer is a thin diamond film. The computation emphasizes the temperature effect of an embedded thin heat source of the type used in electronic devices. The mathematical formulation employs the Green’s function solution method. The solution is time partitioned in order to achieve a high degree of accuracy. Time partitioning greatly improves the convergence of three-dimensional heat conduction solutions. Time-partitioned series solutions with a reduced number of terms yield highly accurate temperature data. A two-layer model is chosen for simplicity of presentation; however, the method can be extended to more than two layers.
publisherThe American Society of Mechanical Engineers (ASME)
titleThermal Characteristics of Two-Layered Bodies With Embedded Thin-Film Heat Source
typeJournal Paper
journal volume115
journal issue3
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.2909329
journal fristpage276
journal lastpage283
identifier eissn1043-7398
keywordsThin films
keywordsHeat
keywordsTemperature
keywordsHeat conduction
keywordsDiamond films
keywordsBoundary-value problems
keywordsComputation AND Temperature distribution
treeJournal of Electronic Packaging:;1993:;volume( 115 ):;issue: 003
contenttypeFulltext


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