Elasto-Plastic Large Deflection Analysis of a Copper FilmSource: Journal of Electronic Packaging:;1992:;volume( 114 ):;issue: 002::page 221Author:J. H. Lau
DOI: 10.1115/1.2906421Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The ductility of a copper film has been determined by an elastoplastic large deflection finite element method. The effective stress and incremental plastic strain and pressure-deflection curves of the copper film have also been provided for a better understanding of its mechanical behavior. Furthermore, for engineering practice convenience, the ductility and effective stress of the copper film have been plotted as functions of measurable variables, i.e., applied pressure and deflection at the center of the bulge.
keyword(s): Copper , Deflection , Pressure , Stress , Ductility , Finite element methods , Mechanical behavior AND Functions ,
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| contributor author | J. H. Lau | |
| date accessioned | 2017-05-08T23:38:08Z | |
| date available | 2017-05-08T23:38:08Z | |
| date copyright | June, 1992 | |
| date issued | 1992 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26129#221_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/110080 | |
| description abstract | The ductility of a copper film has been determined by an elastoplastic large deflection finite element method. The effective stress and incremental plastic strain and pressure-deflection curves of the copper film have also been provided for a better understanding of its mechanical behavior. Furthermore, for engineering practice convenience, the ductility and effective stress of the copper film have been plotted as functions of measurable variables, i.e., applied pressure and deflection at the center of the bulge. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Elasto-Plastic Large Deflection Analysis of a Copper Film | |
| type | Journal Paper | |
| journal volume | 114 | |
| journal issue | 2 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.2906421 | |
| journal fristpage | 221 | |
| journal lastpage | 225 | |
| identifier eissn | 1043-7398 | |
| keywords | Copper | |
| keywords | Deflection | |
| keywords | Pressure | |
| keywords | Stress | |
| keywords | Ductility | |
| keywords | Finite element methods | |
| keywords | Mechanical behavior AND Functions | |
| tree | Journal of Electronic Packaging:;1992:;volume( 114 ):;issue: 002 | |
| contenttype | Fulltext |