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contributor authorJ. H. Lau
date accessioned2017-05-08T23:38:08Z
date available2017-05-08T23:38:08Z
date copyrightJune, 1992
date issued1992
identifier issn1528-9044
identifier otherJEPAE4-26129#221_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/110080
description abstractThe ductility of a copper film has been determined by an elastoplastic large deflection finite element method. The effective stress and incremental plastic strain and pressure-deflection curves of the copper film have also been provided for a better understanding of its mechanical behavior. Furthermore, for engineering practice convenience, the ductility and effective stress of the copper film have been plotted as functions of measurable variables, i.e., applied pressure and deflection at the center of the bulge.
publisherThe American Society of Mechanical Engineers (ASME)
titleElasto-Plastic Large Deflection Analysis of a Copper Film
typeJournal Paper
journal volume114
journal issue2
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.2906421
journal fristpage221
journal lastpage225
identifier eissn1043-7398
keywordsCopper
keywordsDeflection
keywordsPressure
keywordsStress
keywordsDuctility
keywordsFinite element methods
keywordsMechanical behavior AND Functions
treeJournal of Electronic Packaging:;1992:;volume( 114 ):;issue: 002
contenttypeFulltext


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