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    Approximate Structural Analysis of Circuit Card Systems Subjected to Torsion

    Source: Journal of Electronic Packaging:;1992:;volume( 114 ):;issue: 002::page 203
    Author:
    P. A. Engel
    ,
    J. T. Vogelmann
    DOI: 10.1115/1.2906419
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Engineering analysis of module-populated printed circuit cards subjected to torsion is pursued by approximate engineering analysis, numerical (finite element), and experimental means. The engineering theory utilizes a simplified method of evaluating the torsional stiffness and maximum lead force, the latter found at the module corners. Finite element methods are used to check these values for circuit cards with a wide variety of module configurations, starting from a single-module to sixteen PLCC modules, having 44, 68, and 84 J-leads. An experimental torsion apparatus is used to obtain data for further comparison with the former approaches, and for getting data from the geometrically nonlinear (large deflection) range.
    keyword(s): Structural analysis , Torsion , Circuits , Deflection , Stiffness , Force , Finite element methods , Corners (Structural elements) AND Finite element analysis ,
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      Approximate Structural Analysis of Circuit Card Systems Subjected to Torsion

    URI
    http://yetl.yabesh.ir/yetl1/handle/yetl/110077
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    • Journal of Electronic Packaging

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    contributor authorP. A. Engel
    contributor authorJ. T. Vogelmann
    date accessioned2017-05-08T23:38:08Z
    date available2017-05-08T23:38:08Z
    date copyrightJune, 1992
    date issued1992
    identifier issn1528-9044
    identifier otherJEPAE4-26129#203_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/110077
    description abstractEngineering analysis of module-populated printed circuit cards subjected to torsion is pursued by approximate engineering analysis, numerical (finite element), and experimental means. The engineering theory utilizes a simplified method of evaluating the torsional stiffness and maximum lead force, the latter found at the module corners. Finite element methods are used to check these values for circuit cards with a wide variety of module configurations, starting from a single-module to sixteen PLCC modules, having 44, 68, and 84 J-leads. An experimental torsion apparatus is used to obtain data for further comparison with the former approaches, and for getting data from the geometrically nonlinear (large deflection) range.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleApproximate Structural Analysis of Circuit Card Systems Subjected to Torsion
    typeJournal Paper
    journal volume114
    journal issue2
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.2906419
    journal fristpage203
    journal lastpage210
    identifier eissn1043-7398
    keywordsStructural analysis
    keywordsTorsion
    keywordsCircuits
    keywordsDeflection
    keywordsStiffness
    keywordsForce
    keywordsFinite element methods
    keywordsCorners (Structural elements) AND Finite element analysis
    treeJournal of Electronic Packaging:;1992:;volume( 114 ):;issue: 002
    contenttypeFulltext
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    DSpace software copyright © 2002-2015  DuraSpace
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