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contributor authorP. A. Engel
contributor authorJ. T. Vogelmann
date accessioned2017-05-08T23:38:08Z
date available2017-05-08T23:38:08Z
date copyrightJune, 1992
date issued1992
identifier issn1528-9044
identifier otherJEPAE4-26129#203_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/110077
description abstractEngineering analysis of module-populated printed circuit cards subjected to torsion is pursued by approximate engineering analysis, numerical (finite element), and experimental means. The engineering theory utilizes a simplified method of evaluating the torsional stiffness and maximum lead force, the latter found at the module corners. Finite element methods are used to check these values for circuit cards with a wide variety of module configurations, starting from a single-module to sixteen PLCC modules, having 44, 68, and 84 J-leads. An experimental torsion apparatus is used to obtain data for further comparison with the former approaches, and for getting data from the geometrically nonlinear (large deflection) range.
publisherThe American Society of Mechanical Engineers (ASME)
titleApproximate Structural Analysis of Circuit Card Systems Subjected to Torsion
typeJournal Paper
journal volume114
journal issue2
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.2906419
journal fristpage203
journal lastpage210
identifier eissn1043-7398
keywordsStructural analysis
keywordsTorsion
keywordsCircuits
keywordsDeflection
keywordsStiffness
keywordsForce
keywordsFinite element methods
keywordsCorners (Structural elements) AND Finite element analysis
treeJournal of Electronic Packaging:;1992:;volume( 114 ):;issue: 002
contenttypeFulltext


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