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    Deformation and Fracture of Pb-Sn-Eutectic Under Tensile and Fatigue Loading

    Source: Journal of Electronic Packaging:;1992:;volume( 114 ):;issue: 002::page 118
    Author:
    S.-M. Lee
    ,
    D. S. Stone
    DOI: 10.1115/1.2906407
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Room temperature, displacement-controlled tensile test and displacement-controlled tension/compression fatigue tests were performed on as-cast specimens of eutectic Pb-Sn solder with lamellar microstructure. A range of strain rates were used to identify how failure varies with strain rate. Under tensile loading at high strain rate (6.7 × 10−2 /s) failure was observed after about 20 percent strain. There was evidence of shear localization, and failure was transgranular with a dimpled fracture surface. The low strain rate (6.7 × 10−6 /s ) tensile specimen failed by cavitation. This cavitation coincided with sliding at boundaries between colonies of the eutectic (grain boundaries); there was little evidence of sliding in the high strain rate specimen. Two behaviors were observed in the fatigue tests. At low frequency and high strain range (2 × 10−3 /s, 4 percent, Nf ≈ 300−1000) numerous intergranular cracks initiated at the surface, eventually linking up and propagating along grain boundaries to the interior. What appeared to be fatigue striations were found on the crack face. At high frequency and low strains (>0.1/s, <1 percent) transgranular failure dominated.
    keyword(s): Deformation , Fatigue , Fracture (Process) , Failure , Fatigue testing , Displacement , Grain boundaries , Cavitation , Shear (Mechanics) , Compression , Temperature , Solders AND Tension ,
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      Deformation and Fracture of Pb-Sn-Eutectic Under Tensile and Fatigue Loading

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    http://yetl.yabesh.ir/yetl1/handle/yetl/110064
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    contributor authorS.-M. Lee
    contributor authorD. S. Stone
    date accessioned2017-05-08T23:38:07Z
    date available2017-05-08T23:38:07Z
    date copyrightJune, 1992
    date issued1992
    identifier issn1528-9044
    identifier otherJEPAE4-26129#118_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/110064
    description abstractRoom temperature, displacement-controlled tensile test and displacement-controlled tension/compression fatigue tests were performed on as-cast specimens of eutectic Pb-Sn solder with lamellar microstructure. A range of strain rates were used to identify how failure varies with strain rate. Under tensile loading at high strain rate (6.7 × 10−2 /s) failure was observed after about 20 percent strain. There was evidence of shear localization, and failure was transgranular with a dimpled fracture surface. The low strain rate (6.7 × 10−6 /s ) tensile specimen failed by cavitation. This cavitation coincided with sliding at boundaries between colonies of the eutectic (grain boundaries); there was little evidence of sliding in the high strain rate specimen. Two behaviors were observed in the fatigue tests. At low frequency and high strain range (2 × 10−3 /s, 4 percent, Nf ≈ 300−1000) numerous intergranular cracks initiated at the surface, eventually linking up and propagating along grain boundaries to the interior. What appeared to be fatigue striations were found on the crack face. At high frequency and low strains (>0.1/s, <1 percent) transgranular failure dominated.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleDeformation and Fracture of Pb-Sn-Eutectic Under Tensile and Fatigue Loading
    typeJournal Paper
    journal volume114
    journal issue2
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.2906407
    journal fristpage118
    journal lastpage121
    identifier eissn1043-7398
    keywordsDeformation
    keywordsFatigue
    keywordsFracture (Process)
    keywordsFailure
    keywordsFatigue testing
    keywordsDisplacement
    keywordsGrain boundaries
    keywordsCavitation
    keywordsShear (Mechanics)
    keywordsCompression
    keywordsTemperature
    keywordsSolders AND Tension
    treeJournal of Electronic Packaging:;1992:;volume( 114 ):;issue: 002
    contenttypeFulltext
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
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