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    Closing of Surface Flaws Under Compressive Loading

    Source: Journal of Electronic Packaging:;1991:;volume( 113 ):;issue: 001::page 63
    Author:
    W. E. Warren
    ,
    D. E. Amos
    DOI: 10.1115/1.2905368
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The plane elastic deformation of a notched half-plane which is compressed by a flat rigid surface is investigated. The stress and displacement fields of this notched halfplane are felt to be representative of the conditions occurring in the neighborhood of a flaw on the surface of a compressed circular O-ring. O-rings are often installed as environmental seals in electronic components, and the results of this analysis indicate that minor surface flaws do not threaten the integrity of O-ring seals under normal installation conditions. Compressing the O-ring reduces the notch surface opening and pushes the notch surface toward the rigid compressing plate. Both of these effects reduce the notch void volume and the possibility of seal leakage.
    keyword(s): Deformation , Seals , Felts , Stress , Electronic components , Displacement AND Leakage ,
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      Closing of Surface Flaws Under Compressive Loading

    URI
    http://yetl.yabesh.ir/yetl1/handle/yetl/108418
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    contributor authorW. E. Warren
    contributor authorD. E. Amos
    date accessioned2017-05-08T23:35:20Z
    date available2017-05-08T23:35:20Z
    date copyrightMarch, 1991
    date issued1991
    identifier issn1528-9044
    identifier otherJEPAE4-26121#63_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/108418
    description abstractThe plane elastic deformation of a notched half-plane which is compressed by a flat rigid surface is investigated. The stress and displacement fields of this notched halfplane are felt to be representative of the conditions occurring in the neighborhood of a flaw on the surface of a compressed circular O-ring. O-rings are often installed as environmental seals in electronic components, and the results of this analysis indicate that minor surface flaws do not threaten the integrity of O-ring seals under normal installation conditions. Compressing the O-ring reduces the notch surface opening and pushes the notch surface toward the rigid compressing plate. Both of these effects reduce the notch void volume and the possibility of seal leakage.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleClosing of Surface Flaws Under Compressive Loading
    typeJournal Paper
    journal volume113
    journal issue1
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.2905368
    journal fristpage63
    journal lastpage67
    identifier eissn1043-7398
    keywordsDeformation
    keywordsSeals
    keywordsFelts
    keywordsStress
    keywordsElectronic components
    keywordsDisplacement AND Leakage
    treeJournal of Electronic Packaging:;1991:;volume( 113 ):;issue: 001
    contenttypeFulltext
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian