contributor author | W. E. Warren | |
contributor author | D. E. Amos | |
date accessioned | 2017-05-08T23:35:20Z | |
date available | 2017-05-08T23:35:20Z | |
date copyright | March, 1991 | |
date issued | 1991 | |
identifier issn | 1528-9044 | |
identifier other | JEPAE4-26121#63_1.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/108418 | |
description abstract | The plane elastic deformation of a notched half-plane which is compressed by a flat rigid surface is investigated. The stress and displacement fields of this notched halfplane are felt to be representative of the conditions occurring in the neighborhood of a flaw on the surface of a compressed circular O-ring. O-rings are often installed as environmental seals in electronic components, and the results of this analysis indicate that minor surface flaws do not threaten the integrity of O-ring seals under normal installation conditions. Compressing the O-ring reduces the notch surface opening and pushes the notch surface toward the rigid compressing plate. Both of these effects reduce the notch void volume and the possibility of seal leakage. | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | Closing of Surface Flaws Under Compressive Loading | |
type | Journal Paper | |
journal volume | 113 | |
journal issue | 1 | |
journal title | Journal of Electronic Packaging | |
identifier doi | 10.1115/1.2905368 | |
journal fristpage | 63 | |
journal lastpage | 67 | |
identifier eissn | 1043-7398 | |
keywords | Deformation | |
keywords | Seals | |
keywords | Felts | |
keywords | Stress | |
keywords | Electronic components | |
keywords | Displacement AND Leakage | |
tree | Journal of Electronic Packaging:;1991:;volume( 113 ):;issue: 001 | |
contenttype | Fulltext | |