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contributor authorW. E. Warren
contributor authorD. E. Amos
date accessioned2017-05-08T23:35:20Z
date available2017-05-08T23:35:20Z
date copyrightMarch, 1991
date issued1991
identifier issn1528-9044
identifier otherJEPAE4-26121#63_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/108418
description abstractThe plane elastic deformation of a notched half-plane which is compressed by a flat rigid surface is investigated. The stress and displacement fields of this notched halfplane are felt to be representative of the conditions occurring in the neighborhood of a flaw on the surface of a compressed circular O-ring. O-rings are often installed as environmental seals in electronic components, and the results of this analysis indicate that minor surface flaws do not threaten the integrity of O-ring seals under normal installation conditions. Compressing the O-ring reduces the notch surface opening and pushes the notch surface toward the rigid compressing plate. Both of these effects reduce the notch void volume and the possibility of seal leakage.
publisherThe American Society of Mechanical Engineers (ASME)
titleClosing of Surface Flaws Under Compressive Loading
typeJournal Paper
journal volume113
journal issue1
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.2905368
journal fristpage63
journal lastpage67
identifier eissn1043-7398
keywordsDeformation
keywordsSeals
keywordsFelts
keywordsStress
keywordsElectronic components
keywordsDisplacement AND Leakage
treeJournal of Electronic Packaging:;1991:;volume( 113 ):;issue: 001
contenttypeFulltext


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