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    High and Low-Cycle Fatigue Damage Evaluation of Multilayer Thin Film Structure

    Source: Journal of Electronic Packaging:;1991:;volume( 113 ):;issue: 001::page 58
    Author:
    Yoshiki Oshida
    ,
    P. C. Chen
    DOI: 10.1115/1.2905367
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: A five-layered (Cu/Cr/Kapton® /Cr/Cu) metallic thin film structure was subjected to a completely reversed bending fatigue cycling with a wide ranges of applied strain amplitudes from 0.25 percent to about 30 percent. A new model for determination of the number of cycles to fatigue failure NF was proposed for single-crack and multi-crack formations. Within a strain amplitude ranging from 1 to 10 percent, a Manson-Coffin’s relationship was recognized for both the number of cycles to crack initiation NC and NF with exponents of 0.39 and 0.51, respectively. Selected fatigued test samples were further subjected to X-ray diffraction line analysis for dislocation density (ρ) calculation, which was related to the number of fatigue cycles N and strain amplitude (Δ εT ) in an empirical formula. It was also found that dislocation densities accumulated up to both Nc and NF were related to applied strain amplitudes. Consequently, if applied strain amplitude is known and progressive change in dislocation density is measured, one can predict the remaining fatigue life as well as fatigue cycles which were already consumed.
    keyword(s): Thin films , Fatigue , X-ray diffraction , Fracture (Materials) , Cycles , Dislocation density , Dislocations , Fatigue life , Formulas , Low cycle fatigue , Metallic thin films AND Fatigue failure ,
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      High and Low-Cycle Fatigue Damage Evaluation of Multilayer Thin Film Structure

    URI
    http://yetl.yabesh.ir/yetl1/handle/yetl/108417
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    contributor authorYoshiki Oshida
    contributor authorP. C. Chen
    date accessioned2017-05-08T23:35:20Z
    date available2017-05-08T23:35:20Z
    date copyrightMarch, 1991
    date issued1991
    identifier issn1528-9044
    identifier otherJEPAE4-26121#58_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/108417
    description abstractA five-layered (Cu/Cr/Kapton® /Cr/Cu) metallic thin film structure was subjected to a completely reversed bending fatigue cycling with a wide ranges of applied strain amplitudes from 0.25 percent to about 30 percent. A new model for determination of the number of cycles to fatigue failure NF was proposed for single-crack and multi-crack formations. Within a strain amplitude ranging from 1 to 10 percent, a Manson-Coffin’s relationship was recognized for both the number of cycles to crack initiation NC and NF with exponents of 0.39 and 0.51, respectively. Selected fatigued test samples were further subjected to X-ray diffraction line analysis for dislocation density (ρ) calculation, which was related to the number of fatigue cycles N and strain amplitude (Δ εT ) in an empirical formula. It was also found that dislocation densities accumulated up to both Nc and NF were related to applied strain amplitudes. Consequently, if applied strain amplitude is known and progressive change in dislocation density is measured, one can predict the remaining fatigue life as well as fatigue cycles which were already consumed.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleHigh and Low-Cycle Fatigue Damage Evaluation of Multilayer Thin Film Structure
    typeJournal Paper
    journal volume113
    journal issue1
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.2905367
    journal fristpage58
    journal lastpage62
    identifier eissn1043-7398
    keywordsThin films
    keywordsFatigue
    keywordsX-ray diffraction
    keywordsFracture (Materials)
    keywordsCycles
    keywordsDislocation density
    keywordsDislocations
    keywordsFatigue life
    keywordsFormulas
    keywordsLow cycle fatigue
    keywordsMetallic thin films AND Fatigue failure
    treeJournal of Electronic Packaging:;1991:;volume( 113 ):;issue: 001
    contenttypeFulltext
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