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contributor authorYoshiki Oshida
contributor authorP. C. Chen
date accessioned2017-05-08T23:35:20Z
date available2017-05-08T23:35:20Z
date copyrightMarch, 1991
date issued1991
identifier issn1528-9044
identifier otherJEPAE4-26121#58_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/108417
description abstractA five-layered (Cu/Cr/Kapton® /Cr/Cu) metallic thin film structure was subjected to a completely reversed bending fatigue cycling with a wide ranges of applied strain amplitudes from 0.25 percent to about 30 percent. A new model for determination of the number of cycles to fatigue failure NF was proposed for single-crack and multi-crack formations. Within a strain amplitude ranging from 1 to 10 percent, a Manson-Coffin’s relationship was recognized for both the number of cycles to crack initiation NC and NF with exponents of 0.39 and 0.51, respectively. Selected fatigued test samples were further subjected to X-ray diffraction line analysis for dislocation density (ρ) calculation, which was related to the number of fatigue cycles N and strain amplitude (Δ εT ) in an empirical formula. It was also found that dislocation densities accumulated up to both Nc and NF were related to applied strain amplitudes. Consequently, if applied strain amplitude is known and progressive change in dislocation density is measured, one can predict the remaining fatigue life as well as fatigue cycles which were already consumed.
publisherThe American Society of Mechanical Engineers (ASME)
titleHigh and Low-Cycle Fatigue Damage Evaluation of Multilayer Thin Film Structure
typeJournal Paper
journal volume113
journal issue1
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.2905367
journal fristpage58
journal lastpage62
identifier eissn1043-7398
keywordsThin films
keywordsFatigue
keywordsX-ray diffraction
keywordsFracture (Materials)
keywordsCycles
keywordsDislocation density
keywordsDislocations
keywordsFatigue life
keywordsFormulas
keywordsLow cycle fatigue
keywordsMetallic thin films AND Fatigue failure
treeJournal of Electronic Packaging:;1991:;volume( 113 ):;issue: 001
contenttypeFulltext


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