Effects of Peeling Stresses in Bimaterial AssemblySource: Journal of Electronic Packaging:;1991:;volume( 113 ):;issue: 004::page 431Author:Ilya B. Mirman
DOI: 10.1115/1.2905433Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Peeling stress is experimentally shown to be an important factor for delamination in thermally mismatched bimaterial assembly. Strips of the plastic ULTEM-1000 and nickel alloy Kovar were attached with Devcon 14200 epoxy, and the temperature was raised from the stress-free curing temperature for one set of samples, and lowered for another set of samples, resulting in interfacial stresses. The samples that delaminated had the highest peeling stress.
keyword(s): Stress , Manufacturing , Temperature , Nickel alloys , Epoxy adhesives , Curing , Strips AND Delamination ,
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contributor author | Ilya B. Mirman | |
date accessioned | 2017-05-08T23:35:13Z | |
date available | 2017-05-08T23:35:13Z | |
date copyright | December, 1991 | |
date issued | 1991 | |
identifier issn | 1528-9044 | |
identifier other | JEPAE4-26124#431_1.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/108366 | |
description abstract | Peeling stress is experimentally shown to be an important factor for delamination in thermally mismatched bimaterial assembly. Strips of the plastic ULTEM-1000 and nickel alloy Kovar were attached with Devcon 14200 epoxy, and the temperature was raised from the stress-free curing temperature for one set of samples, and lowered for another set of samples, resulting in interfacial stresses. The samples that delaminated had the highest peeling stress. | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | Effects of Peeling Stresses in Bimaterial Assembly | |
type | Journal Paper | |
journal volume | 113 | |
journal issue | 4 | |
journal title | Journal of Electronic Packaging | |
identifier doi | 10.1115/1.2905433 | |
journal fristpage | 431 | |
journal lastpage | 433 | |
identifier eissn | 1043-7398 | |
keywords | Stress | |
keywords | Manufacturing | |
keywords | Temperature | |
keywords | Nickel alloys | |
keywords | Epoxy adhesives | |
keywords | Curing | |
keywords | Strips AND Delamination | |
tree | Journal of Electronic Packaging:;1991:;volume( 113 ):;issue: 004 | |
contenttype | Fulltext |