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    Effects of Peeling Stresses in Bimaterial Assembly

    Source: Journal of Electronic Packaging:;1991:;volume( 113 ):;issue: 004::page 431
    Author:
    Ilya B. Mirman
    DOI: 10.1115/1.2905433
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Peeling stress is experimentally shown to be an important factor for delamination in thermally mismatched bimaterial assembly. Strips of the plastic ULTEM-1000 and nickel alloy Kovar were attached with Devcon 14200 epoxy, and the temperature was raised from the stress-free curing temperature for one set of samples, and lowered for another set of samples, resulting in interfacial stresses. The samples that delaminated had the highest peeling stress.
    keyword(s): Stress , Manufacturing , Temperature , Nickel alloys , Epoxy adhesives , Curing , Strips AND Delamination ,
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      Effects of Peeling Stresses in Bimaterial Assembly

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    contributor authorIlya B. Mirman
    date accessioned2017-05-08T23:35:13Z
    date available2017-05-08T23:35:13Z
    date copyrightDecember, 1991
    date issued1991
    identifier issn1528-9044
    identifier otherJEPAE4-26124#431_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/108366
    description abstractPeeling stress is experimentally shown to be an important factor for delamination in thermally mismatched bimaterial assembly. Strips of the plastic ULTEM-1000 and nickel alloy Kovar were attached with Devcon 14200 epoxy, and the temperature was raised from the stress-free curing temperature for one set of samples, and lowered for another set of samples, resulting in interfacial stresses. The samples that delaminated had the highest peeling stress.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleEffects of Peeling Stresses in Bimaterial Assembly
    typeJournal Paper
    journal volume113
    journal issue4
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.2905433
    journal fristpage431
    journal lastpage433
    identifier eissn1043-7398
    keywordsStress
    keywordsManufacturing
    keywordsTemperature
    keywordsNickel alloys
    keywordsEpoxy adhesives
    keywordsCuring
    keywordsStrips AND Delamination
    treeJournal of Electronic Packaging:;1991:;volume( 113 ):;issue: 004
    contenttypeFulltext
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    DSpace software copyright © 2002-2015  DuraSpace
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