| contributor author | Ilya B. Mirman | |
| date accessioned | 2017-05-08T23:35:13Z | |
| date available | 2017-05-08T23:35:13Z | |
| date copyright | December, 1991 | |
| date issued | 1991 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26124#431_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/108366 | |
| description abstract | Peeling stress is experimentally shown to be an important factor for delamination in thermally mismatched bimaterial assembly. Strips of the plastic ULTEM-1000 and nickel alloy Kovar were attached with Devcon 14200 epoxy, and the temperature was raised from the stress-free curing temperature for one set of samples, and lowered for another set of samples, resulting in interfacial stresses. The samples that delaminated had the highest peeling stress. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Effects of Peeling Stresses in Bimaterial Assembly | |
| type | Journal Paper | |
| journal volume | 113 | |
| journal issue | 4 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.2905433 | |
| journal fristpage | 431 | |
| journal lastpage | 433 | |
| identifier eissn | 1043-7398 | |
| keywords | Stress | |
| keywords | Manufacturing | |
| keywords | Temperature | |
| keywords | Nickel alloys | |
| keywords | Epoxy adhesives | |
| keywords | Curing | |
| keywords | Strips AND Delamination | |
| tree | Journal of Electronic Packaging:;1991:;volume( 113 ):;issue: 004 | |
| contenttype | Fulltext | |
