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    Elasticity Analysis to Aid in Extracting Thin Film Elastic Moduli From Continuous Indentation Data

    Source: Journal of Electronic Packaging:;1990:;volume( 112 ):;issue: 001::page 41
    Author:
    D. S. Stone
    DOI: 10.1115/1.2904339
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: This article provides elasticity solutions to the indentation of a bilayer by three-sided and four-sided indentors. These solutions aid characterization of thin film elastic moduli through continuous indentation techniques. The solutions are expressed in closed-form, and can be numerically evaluated on a small computer; additionally, graphs of some of the solutions are provided to aid in rapid data analysis. Simulations of unloading compliance, C, versus 1/A1/2 (A = projected area of indent) are compared with experimental data. The data are taken from measurements of single crystal Si, polycrystalline Al, and 1 μm Al deposited on Si. The elasticity analysis is used in the measurement of the elastic modulus of a sodium borosilicate glass, and the same glass but with a damaged surface layer introduced by suspension in an acid solution.
    keyword(s): Thin films , Elasticity , Elastic moduli , Sodium , Crystals , Glass , Measurement , Heat resistant glass , Engineering simulation AND Computers ,
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      Elasticity Analysis to Aid in Extracting Thin Film Elastic Moduli From Continuous Indentation Data

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    http://yetl.yabesh.ir/yetl1/handle/yetl/106797
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    contributor authorD. S. Stone
    date accessioned2017-05-08T23:32:26Z
    date available2017-05-08T23:32:26Z
    date copyrightMarch, 1990
    date issued1990
    identifier issn1528-9044
    identifier otherJEPAE4-26114#41_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/106797
    description abstractThis article provides elasticity solutions to the indentation of a bilayer by three-sided and four-sided indentors. These solutions aid characterization of thin film elastic moduli through continuous indentation techniques. The solutions are expressed in closed-form, and can be numerically evaluated on a small computer; additionally, graphs of some of the solutions are provided to aid in rapid data analysis. Simulations of unloading compliance, C, versus 1/A1/2 (A = projected area of indent) are compared with experimental data. The data are taken from measurements of single crystal Si, polycrystalline Al, and 1 μm Al deposited on Si. The elasticity analysis is used in the measurement of the elastic modulus of a sodium borosilicate glass, and the same glass but with a damaged surface layer introduced by suspension in an acid solution.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleElasticity Analysis to Aid in Extracting Thin Film Elastic Moduli From Continuous Indentation Data
    typeJournal Paper
    journal volume112
    journal issue1
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.2904339
    journal fristpage41
    journal lastpage46
    identifier eissn1043-7398
    keywordsThin films
    keywordsElasticity
    keywordsElastic moduli
    keywordsSodium
    keywordsCrystals
    keywordsGlass
    keywordsMeasurement
    keywordsHeat resistant glass
    keywordsEngineering simulation AND Computers
    treeJournal of Electronic Packaging:;1990:;volume( 112 ):;issue: 001
    contenttypeFulltext
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    DSpace software copyright © 2002-2015  DuraSpace
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