Elasticity Analysis to Aid in Extracting Thin Film Elastic Moduli From Continuous Indentation DataSource: Journal of Electronic Packaging:;1990:;volume( 112 ):;issue: 001::page 41Author:D. S. Stone
DOI: 10.1115/1.2904339Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This article provides elasticity solutions to the indentation of a bilayer by three-sided and four-sided indentors. These solutions aid characterization of thin film elastic moduli through continuous indentation techniques. The solutions are expressed in closed-form, and can be numerically evaluated on a small computer; additionally, graphs of some of the solutions are provided to aid in rapid data analysis. Simulations of unloading compliance, C, versus 1/A1/2 (A = projected area of indent) are compared with experimental data. The data are taken from measurements of single crystal Si, polycrystalline Al, and 1 μm Al deposited on Si. The elasticity analysis is used in the measurement of the elastic modulus of a sodium borosilicate glass, and the same glass but with a damaged surface layer introduced by suspension in an acid solution.
keyword(s): Thin films , Elasticity , Elastic moduli , Sodium , Crystals , Glass , Measurement , Heat resistant glass , Engineering simulation AND Computers ,
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contributor author | D. S. Stone | |
date accessioned | 2017-05-08T23:32:26Z | |
date available | 2017-05-08T23:32:26Z | |
date copyright | March, 1990 | |
date issued | 1990 | |
identifier issn | 1528-9044 | |
identifier other | JEPAE4-26114#41_1.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/106797 | |
description abstract | This article provides elasticity solutions to the indentation of a bilayer by three-sided and four-sided indentors. These solutions aid characterization of thin film elastic moduli through continuous indentation techniques. The solutions are expressed in closed-form, and can be numerically evaluated on a small computer; additionally, graphs of some of the solutions are provided to aid in rapid data analysis. Simulations of unloading compliance, C, versus 1/A1/2 (A = projected area of indent) are compared with experimental data. The data are taken from measurements of single crystal Si, polycrystalline Al, and 1 μm Al deposited on Si. The elasticity analysis is used in the measurement of the elastic modulus of a sodium borosilicate glass, and the same glass but with a damaged surface layer introduced by suspension in an acid solution. | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | Elasticity Analysis to Aid in Extracting Thin Film Elastic Moduli From Continuous Indentation Data | |
type | Journal Paper | |
journal volume | 112 | |
journal issue | 1 | |
journal title | Journal of Electronic Packaging | |
identifier doi | 10.1115/1.2904339 | |
journal fristpage | 41 | |
journal lastpage | 46 | |
identifier eissn | 1043-7398 | |
keywords | Thin films | |
keywords | Elasticity | |
keywords | Elastic moduli | |
keywords | Sodium | |
keywords | Crystals | |
keywords | Glass | |
keywords | Measurement | |
keywords | Heat resistant glass | |
keywords | Engineering simulation AND Computers | |
tree | Journal of Electronic Packaging:;1990:;volume( 112 ):;issue: 001 | |
contenttype | Fulltext |