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contributor authorD. S. Stone
date accessioned2017-05-08T23:32:26Z
date available2017-05-08T23:32:26Z
date copyrightMarch, 1990
date issued1990
identifier issn1528-9044
identifier otherJEPAE4-26114#41_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/106797
description abstractThis article provides elasticity solutions to the indentation of a bilayer by three-sided and four-sided indentors. These solutions aid characterization of thin film elastic moduli through continuous indentation techniques. The solutions are expressed in closed-form, and can be numerically evaluated on a small computer; additionally, graphs of some of the solutions are provided to aid in rapid data analysis. Simulations of unloading compliance, C, versus 1/A1/2 (A = projected area of indent) are compared with experimental data. The data are taken from measurements of single crystal Si, polycrystalline Al, and 1 μm Al deposited on Si. The elasticity analysis is used in the measurement of the elastic modulus of a sodium borosilicate glass, and the same glass but with a damaged surface layer introduced by suspension in an acid solution.
publisherThe American Society of Mechanical Engineers (ASME)
titleElasticity Analysis to Aid in Extracting Thin Film Elastic Moduli From Continuous Indentation Data
typeJournal Paper
journal volume112
journal issue1
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.2904339
journal fristpage41
journal lastpage46
identifier eissn1043-7398
keywordsThin films
keywordsElasticity
keywordsElastic moduli
keywordsSodium
keywordsCrystals
keywordsGlass
keywordsMeasurement
keywordsHeat resistant glass
keywordsEngineering simulation AND Computers
treeJournal of Electronic Packaging:;1990:;volume( 112 ):;issue: 001
contenttypeFulltext


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