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    Thermal Stresses in Compliantly Joined Materials

    Source: Journal of Electronic Packaging:;1990:;volume( 112 ):;issue: 001::page 24
    Author:
    J. C. Glaser
    DOI: 10.1115/1.2904335
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: In the past several years there have been a number of papers published which provide closed-form solutions for the stresses in bonded layers of materials. These closed-form solutions offer a rapid method to obtain first-order stresses for materials which are joined together and the compliant layer between them. However, before using them, it is desirable to have some feeling as to the accuracy of the results from these closed-form equations. Comparisons between these analytical relations and other approaches found in published works on bonding and to finite element solutions for several example problems are given. An attempt is made to qualify these closed-form equations in terms of their accuracy, as compared to other methods of analysis. The effects of finite element mesh refinement on the material interface stress results are also given.
    keyword(s): Bonding , Stress , Thermal stresses , Finite element analysis AND Equations ,
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      Thermal Stresses in Compliantly Joined Materials

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    http://yetl.yabesh.ir/yetl1/handle/yetl/106794
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    contributor authorJ. C. Glaser
    date accessioned2017-05-08T23:32:26Z
    date available2017-05-08T23:32:26Z
    date copyrightMarch, 1990
    date issued1990
    identifier issn1528-9044
    identifier otherJEPAE4-26114#24_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/106794
    description abstractIn the past several years there have been a number of papers published which provide closed-form solutions for the stresses in bonded layers of materials. These closed-form solutions offer a rapid method to obtain first-order stresses for materials which are joined together and the compliant layer between them. However, before using them, it is desirable to have some feeling as to the accuracy of the results from these closed-form equations. Comparisons between these analytical relations and other approaches found in published works on bonding and to finite element solutions for several example problems are given. An attempt is made to qualify these closed-form equations in terms of their accuracy, as compared to other methods of analysis. The effects of finite element mesh refinement on the material interface stress results are also given.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleThermal Stresses in Compliantly Joined Materials
    typeJournal Paper
    journal volume112
    journal issue1
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.2904335
    journal fristpage24
    journal lastpage29
    identifier eissn1043-7398
    keywordsBonding
    keywordsStress
    keywordsThermal stresses
    keywordsFinite element analysis AND Equations
    treeJournal of Electronic Packaging:;1990:;volume( 112 ):;issue: 001
    contenttypeFulltext
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
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