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contributor authorJ. C. Glaser
date accessioned2017-05-08T23:32:26Z
date available2017-05-08T23:32:26Z
date copyrightMarch, 1990
date issued1990
identifier issn1528-9044
identifier otherJEPAE4-26114#24_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/106794
description abstractIn the past several years there have been a number of papers published which provide closed-form solutions for the stresses in bonded layers of materials. These closed-form solutions offer a rapid method to obtain first-order stresses for materials which are joined together and the compliant layer between them. However, before using them, it is desirable to have some feeling as to the accuracy of the results from these closed-form equations. Comparisons between these analytical relations and other approaches found in published works on bonding and to finite element solutions for several example problems are given. An attempt is made to qualify these closed-form equations in terms of their accuracy, as compared to other methods of analysis. The effects of finite element mesh refinement on the material interface stress results are also given.
publisherThe American Society of Mechanical Engineers (ASME)
titleThermal Stresses in Compliantly Joined Materials
typeJournal Paper
journal volume112
journal issue1
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.2904335
journal fristpage24
journal lastpage29
identifier eissn1043-7398
keywordsBonding
keywordsStress
keywordsThermal stresses
keywordsFinite element analysis AND Equations
treeJournal of Electronic Packaging:;1990:;volume( 112 ):;issue: 001
contenttypeFulltext


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