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    Determination of Stress Intensity Factors for Interfacial Cracks in Bimaterial Systems

    Source: Journal of Electronic Packaging:;1990:;volume( 112 ):;issue: 002::page 154
    Author:
    Yi-Hsin Pao
    ,
    Tsung-Yu Pan
    DOI: 10.1115/1.2904356
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: A relatively simple numerical method was developed to determine the stress intensity factors of interfacial cracks in bimaterial systems. The method is based on the evaluation of crack tip stress components using a p-version finite element method. Numerical experiments on a number of specimen geometries covering a wide range of material combination were performed. The geometries tested include a center-cracked panel (CCP), a single-lap shear joint (SLS) having two anti-symmetric cracks at the edges, a four-point bend specimen, and a bonded double-cantileverbeam (DCB) specimen. The numerical results agreed well with the analytical solutions and the experimental data of certain geometries. The range of integration distance over which accurate stress intensity factors can be determined was found to be within 10−5 and 10−3 of crack length and seems to be geometry independent.
    keyword(s): Stress , Fracture (Materials) , Numerical analysis , Geometry , Shear (Mechanics) AND Finite element methods ,
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      Determination of Stress Intensity Factors for Interfacial Cracks in Bimaterial Systems

    URI
    http://yetl.yabesh.ir/yetl1/handle/yetl/106785
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    • Journal of Electronic Packaging

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    contributor authorYi-Hsin Pao
    contributor authorTsung-Yu Pan
    date accessioned2017-05-08T23:32:25Z
    date available2017-05-08T23:32:25Z
    date copyrightJune, 1990
    date issued1990
    identifier issn1528-9044
    identifier otherJEPAE4-26116#154_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/106785
    description abstractA relatively simple numerical method was developed to determine the stress intensity factors of interfacial cracks in bimaterial systems. The method is based on the evaluation of crack tip stress components using a p-version finite element method. Numerical experiments on a number of specimen geometries covering a wide range of material combination were performed. The geometries tested include a center-cracked panel (CCP), a single-lap shear joint (SLS) having two anti-symmetric cracks at the edges, a four-point bend specimen, and a bonded double-cantileverbeam (DCB) specimen. The numerical results agreed well with the analytical solutions and the experimental data of certain geometries. The range of integration distance over which accurate stress intensity factors can be determined was found to be within 10−5 and 10−3 of crack length and seems to be geometry independent.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleDetermination of Stress Intensity Factors for Interfacial Cracks in Bimaterial Systems
    typeJournal Paper
    journal volume112
    journal issue2
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.2904356
    journal fristpage154
    journal lastpage161
    identifier eissn1043-7398
    keywordsStress
    keywordsFracture (Materials)
    keywordsNumerical analysis
    keywordsGeometry
    keywordsShear (Mechanics) AND Finite element methods
    treeJournal of Electronic Packaging:;1990:;volume( 112 ):;issue: 002
    contenttypeFulltext
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
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