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contributor authorYi-Hsin Pao
contributor authorTsung-Yu Pan
date accessioned2017-05-08T23:32:25Z
date available2017-05-08T23:32:25Z
date copyrightJune, 1990
date issued1990
identifier issn1528-9044
identifier otherJEPAE4-26116#154_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/106785
description abstractA relatively simple numerical method was developed to determine the stress intensity factors of interfacial cracks in bimaterial systems. The method is based on the evaluation of crack tip stress components using a p-version finite element method. Numerical experiments on a number of specimen geometries covering a wide range of material combination were performed. The geometries tested include a center-cracked panel (CCP), a single-lap shear joint (SLS) having two anti-symmetric cracks at the edges, a four-point bend specimen, and a bonded double-cantileverbeam (DCB) specimen. The numerical results agreed well with the analytical solutions and the experimental data of certain geometries. The range of integration distance over which accurate stress intensity factors can be determined was found to be within 10−5 and 10−3 of crack length and seems to be geometry independent.
publisherThe American Society of Mechanical Engineers (ASME)
titleDetermination of Stress Intensity Factors for Interfacial Cracks in Bimaterial Systems
typeJournal Paper
journal volume112
journal issue2
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.2904356
journal fristpage154
journal lastpage161
identifier eissn1043-7398
keywordsStress
keywordsFracture (Materials)
keywordsNumerical analysis
keywordsGeometry
keywordsShear (Mechanics) AND Finite element methods
treeJournal of Electronic Packaging:;1990:;volume( 112 ):;issue: 002
contenttypeFulltext


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