High and Low Temperature Strain-Life Behavior of a Pb Rich SolderSource: Journal of Electronic Packaging:;1990:;volume( 112 ):;issue: 002::page 123Author:H. D. Solomon
DOI: 10.1115/1.2904352Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This paper describes the fatigue behavior of a Pb rich solder, 92.5Pb, 2.5Ag, 5.0Sn (Indalloy 151), tested at −50°C and +150°C. The results are compared to previously reported studies of 60Sn/40Pb solder and to tests of Indalloy 151 performed at 35° C. The Coffin-Manson exponent is larger at all temperatures for the Indalloy 151 compared to the 60Sn/40Pb, but this effect is especially pronounced at +150° C where the exponent is 0.85 for the Indalloy 151 and only 0.35 for the 60Sn/40Pb. This gives rise to a crossover in the behavior of the two solders with the Indalloy 151 exhibiting a longer fatigue life at high strains and the 60Sn/40Pb exhibiting superior behavior at low strains.
keyword(s): Solders , Low temperature , Fatigue life , Fatigue AND Temperature ,
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| contributor author | H. D. Solomon | |
| date accessioned | 2017-05-08T23:32:24Z | |
| date available | 2017-05-08T23:32:24Z | |
| date copyright | June, 1990 | |
| date issued | 1990 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26116#123_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/106781 | |
| description abstract | This paper describes the fatigue behavior of a Pb rich solder, 92.5Pb, 2.5Ag, 5.0Sn (Indalloy 151), tested at −50°C and +150°C. The results are compared to previously reported studies of 60Sn/40Pb solder and to tests of Indalloy 151 performed at 35° C. The Coffin-Manson exponent is larger at all temperatures for the Indalloy 151 compared to the 60Sn/40Pb, but this effect is especially pronounced at +150° C where the exponent is 0.85 for the Indalloy 151 and only 0.35 for the 60Sn/40Pb. This gives rise to a crossover in the behavior of the two solders with the Indalloy 151 exhibiting a longer fatigue life at high strains and the 60Sn/40Pb exhibiting superior behavior at low strains. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | High and Low Temperature Strain-Life Behavior of a Pb Rich Solder | |
| type | Journal Paper | |
| journal volume | 112 | |
| journal issue | 2 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.2904352 | |
| journal fristpage | 123 | |
| journal lastpage | 128 | |
| identifier eissn | 1043-7398 | |
| keywords | Solders | |
| keywords | Low temperature | |
| keywords | Fatigue life | |
| keywords | Fatigue AND Temperature | |
| tree | Journal of Electronic Packaging:;1990:;volume( 112 ):;issue: 002 | |
| contenttype | Fulltext |