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contributor authorH. D. Solomon
date accessioned2017-05-08T23:32:24Z
date available2017-05-08T23:32:24Z
date copyrightJune, 1990
date issued1990
identifier issn1528-9044
identifier otherJEPAE4-26116#123_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/106781
description abstractThis paper describes the fatigue behavior of a Pb rich solder, 92.5Pb, 2.5Ag, 5.0Sn (Indalloy 151), tested at −50°C and +150°C. The results are compared to previously reported studies of 60Sn/40Pb solder and to tests of Indalloy 151 performed at 35° C. The Coffin-Manson exponent is larger at all temperatures for the Indalloy 151 compared to the 60Sn/40Pb, but this effect is especially pronounced at +150° C where the exponent is 0.85 for the Indalloy 151 and only 0.35 for the 60Sn/40Pb. This gives rise to a crossover in the behavior of the two solders with the Indalloy 151 exhibiting a longer fatigue life at high strains and the 60Sn/40Pb exhibiting superior behavior at low strains.
publisherThe American Society of Mechanical Engineers (ASME)
titleHigh and Low Temperature Strain-Life Behavior of a Pb Rich Solder
typeJournal Paper
journal volume112
journal issue2
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.2904352
journal fristpage123
journal lastpage128
identifier eissn1043-7398
keywordsSolders
keywordsLow temperature
keywordsFatigue life
keywordsFatigue AND Temperature
treeJournal of Electronic Packaging:;1990:;volume( 112 ):;issue: 002
contenttypeFulltext


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