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    Slow Crack Growth in Glasses and Ceramics Under Residual and Applied Stresses

    Source: Journal of Electronic Packaging:;1989:;volume( 111 ):;issue: 001::page 61
    Author:
    F. Erdogan
    DOI: 10.1115/1.3226510
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The problem of slow crack growth under residual stresses and externally applied loads in plates is considered. Even though the technique developed to treat the problem is quite general, in the solution given it is assumed that the plate contains a surface crack and the residual stresses are compressive near and at the surfaces and tensile in the interior. The crack would start growing subcritically when the stress intensity factor exceeds a threshold value. Initially the crack faces near the plate surface would remain closed. A crack-contact problem would, therefore, have to be solved to calculate the stress intensity factor. Depending on the relative magnitudes of the residual and applied stresses and the threshold and critical stress intensity factors, the subcritically growing crack would either be arrested or become unstable. The problem is solved and examples showing the time to crack arrest or failure are discussed.
    keyword(s): Stress , Fracture (Materials) , Ceramics , Glass , Residual stresses , Plates (structures) , Failure AND Surface cracks ,
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      Slow Crack Growth in Glasses and Ceramics Under Residual and Applied Stresses

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    http://yetl.yabesh.ir/yetl1/handle/yetl/105275
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    contributor authorF. Erdogan
    date accessioned2017-05-08T23:29:46Z
    date available2017-05-08T23:29:46Z
    date copyrightMarch, 1989
    date issued1989
    identifier issn1528-9044
    identifier otherJEPAE4-26106#61_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/105275
    description abstractThe problem of slow crack growth under residual stresses and externally applied loads in plates is considered. Even though the technique developed to treat the problem is quite general, in the solution given it is assumed that the plate contains a surface crack and the residual stresses are compressive near and at the surfaces and tensile in the interior. The crack would start growing subcritically when the stress intensity factor exceeds a threshold value. Initially the crack faces near the plate surface would remain closed. A crack-contact problem would, therefore, have to be solved to calculate the stress intensity factor. Depending on the relative magnitudes of the residual and applied stresses and the threshold and critical stress intensity factors, the subcritically growing crack would either be arrested or become unstable. The problem is solved and examples showing the time to crack arrest or failure are discussed.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleSlow Crack Growth in Glasses and Ceramics Under Residual and Applied Stresses
    typeJournal Paper
    journal volume111
    journal issue1
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.3226510
    journal fristpage61
    journal lastpage67
    identifier eissn1043-7398
    keywordsStress
    keywordsFracture (Materials)
    keywordsCeramics
    keywordsGlass
    keywordsResidual stresses
    keywordsPlates (structures)
    keywordsFailure AND Surface cracks
    treeJournal of Electronic Packaging:;1989:;volume( 111 ):;issue: 001
    contenttypeFulltext
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
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