Slow Crack Growth in Glasses and Ceramics Under Residual and Applied StressesSource: Journal of Electronic Packaging:;1989:;volume( 111 ):;issue: 001::page 61Author:F. Erdogan
DOI: 10.1115/1.3226510Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The problem of slow crack growth under residual stresses and externally applied loads in plates is considered. Even though the technique developed to treat the problem is quite general, in the solution given it is assumed that the plate contains a surface crack and the residual stresses are compressive near and at the surfaces and tensile in the interior. The crack would start growing subcritically when the stress intensity factor exceeds a threshold value. Initially the crack faces near the plate surface would remain closed. A crack-contact problem would, therefore, have to be solved to calculate the stress intensity factor. Depending on the relative magnitudes of the residual and applied stresses and the threshold and critical stress intensity factors, the subcritically growing crack would either be arrested or become unstable. The problem is solved and examples showing the time to crack arrest or failure are discussed.
keyword(s): Stress , Fracture (Materials) , Ceramics , Glass , Residual stresses , Plates (structures) , Failure AND Surface cracks ,
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contributor author | F. Erdogan | |
date accessioned | 2017-05-08T23:29:46Z | |
date available | 2017-05-08T23:29:46Z | |
date copyright | March, 1989 | |
date issued | 1989 | |
identifier issn | 1528-9044 | |
identifier other | JEPAE4-26106#61_1.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/105275 | |
description abstract | The problem of slow crack growth under residual stresses and externally applied loads in plates is considered. Even though the technique developed to treat the problem is quite general, in the solution given it is assumed that the plate contains a surface crack and the residual stresses are compressive near and at the surfaces and tensile in the interior. The crack would start growing subcritically when the stress intensity factor exceeds a threshold value. Initially the crack faces near the plate surface would remain closed. A crack-contact problem would, therefore, have to be solved to calculate the stress intensity factor. Depending on the relative magnitudes of the residual and applied stresses and the threshold and critical stress intensity factors, the subcritically growing crack would either be arrested or become unstable. The problem is solved and examples showing the time to crack arrest or failure are discussed. | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | Slow Crack Growth in Glasses and Ceramics Under Residual and Applied Stresses | |
type | Journal Paper | |
journal volume | 111 | |
journal issue | 1 | |
journal title | Journal of Electronic Packaging | |
identifier doi | 10.1115/1.3226510 | |
journal fristpage | 61 | |
journal lastpage | 67 | |
identifier eissn | 1043-7398 | |
keywords | Stress | |
keywords | Fracture (Materials) | |
keywords | Ceramics | |
keywords | Glass | |
keywords | Residual stresses | |
keywords | Plates (structures) | |
keywords | Failure AND Surface cracks | |
tree | Journal of Electronic Packaging:;1989:;volume( 111 ):;issue: 001 | |
contenttype | Fulltext |