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contributor authorF. Erdogan
date accessioned2017-05-08T23:29:46Z
date available2017-05-08T23:29:46Z
date copyrightMarch, 1989
date issued1989
identifier issn1528-9044
identifier otherJEPAE4-26106#61_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/105275
description abstractThe problem of slow crack growth under residual stresses and externally applied loads in plates is considered. Even though the technique developed to treat the problem is quite general, in the solution given it is assumed that the plate contains a surface crack and the residual stresses are compressive near and at the surfaces and tensile in the interior. The crack would start growing subcritically when the stress intensity factor exceeds a threshold value. Initially the crack faces near the plate surface would remain closed. A crack-contact problem would, therefore, have to be solved to calculate the stress intensity factor. Depending on the relative magnitudes of the residual and applied stresses and the threshold and critical stress intensity factors, the subcritically growing crack would either be arrested or become unstable. The problem is solved and examples showing the time to crack arrest or failure are discussed.
publisherThe American Society of Mechanical Engineers (ASME)
titleSlow Crack Growth in Glasses and Ceramics Under Residual and Applied Stresses
typeJournal Paper
journal volume111
journal issue1
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.3226510
journal fristpage61
journal lastpage67
identifier eissn1043-7398
keywordsStress
keywordsFracture (Materials)
keywordsCeramics
keywordsGlass
keywordsResidual stresses
keywordsPlates (structures)
keywordsFailure AND Surface cracks
treeJournal of Electronic Packaging:;1989:;volume( 111 ):;issue: 001
contenttypeFulltext


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