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    Strain-Life Behavior in 60/40 Solder

    Source: Journal of Electronic Packaging:;1989:;volume( 111 ):;issue: 002::page 75
    Author:
    H. D. Solomon
    DOI: 10.1115/1.3226525
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: This paper describes low cycle fatigue test run at −50°C, 35°C, 125°C, and 150°C on thin 60 Sn/40 Pb solder joints, tested in simple shear. The low cycle fatigue behavior was found to be a function of the criteria used to define the fatigue life. Different drops in the hysteresis load, measured when a constant plastic strain is being applied, was used to define failure. Not only was the magnitude of the fatigue life a function of the load drop definition for failure, it was also found that the Coffin-Manson low cycle fatigue exponent was a function of this definition. The choice of dependent variable for the curve fitting procedure used to calculate the Coffin-Manson exponent is also considered.
    keyword(s): Solders , Stress , Drops , Shear (Mechanics) , Failure , Fatigue life , Fittings , Low cycle fatigue AND Solder joints ,
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      Strain-Life Behavior in 60/40 Solder

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    http://yetl.yabesh.ir/yetl1/handle/yetl/105252
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    contributor authorH. D. Solomon
    date accessioned2017-05-08T23:29:44Z
    date available2017-05-08T23:29:44Z
    date copyrightJune, 1989
    date issued1989
    identifier issn1528-9044
    identifier otherJEPAE4-26108#75_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/105252
    description abstractThis paper describes low cycle fatigue test run at −50°C, 35°C, 125°C, and 150°C on thin 60 Sn/40 Pb solder joints, tested in simple shear. The low cycle fatigue behavior was found to be a function of the criteria used to define the fatigue life. Different drops in the hysteresis load, measured when a constant plastic strain is being applied, was used to define failure. Not only was the magnitude of the fatigue life a function of the load drop definition for failure, it was also found that the Coffin-Manson low cycle fatigue exponent was a function of this definition. The choice of dependent variable for the curve fitting procedure used to calculate the Coffin-Manson exponent is also considered.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleStrain-Life Behavior in 60/40 Solder
    typeJournal Paper
    journal volume111
    journal issue2
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.3226525
    journal fristpage75
    journal lastpage82
    identifier eissn1043-7398
    keywordsSolders
    keywordsStress
    keywordsDrops
    keywordsShear (Mechanics)
    keywordsFailure
    keywordsFatigue life
    keywordsFittings
    keywordsLow cycle fatigue AND Solder joints
    treeJournal of Electronic Packaging:;1989:;volume( 111 ):;issue: 002
    contenttypeFulltext
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
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