| contributor author | H. D. Solomon | |
| date accessioned | 2017-05-08T23:29:44Z | |
| date available | 2017-05-08T23:29:44Z | |
| date copyright | June, 1989 | |
| date issued | 1989 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26108#75_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/105252 | |
| description abstract | This paper describes low cycle fatigue test run at −50°C, 35°C, 125°C, and 150°C on thin 60 Sn/40 Pb solder joints, tested in simple shear. The low cycle fatigue behavior was found to be a function of the criteria used to define the fatigue life. Different drops in the hysteresis load, measured when a constant plastic strain is being applied, was used to define failure. Not only was the magnitude of the fatigue life a function of the load drop definition for failure, it was also found that the Coffin-Manson low cycle fatigue exponent was a function of this definition. The choice of dependent variable for the curve fitting procedure used to calculate the Coffin-Manson exponent is also considered. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Strain-Life Behavior in 60/40 Solder | |
| type | Journal Paper | |
| journal volume | 111 | |
| journal issue | 2 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.3226525 | |
| journal fristpage | 75 | |
| journal lastpage | 82 | |
| identifier eissn | 1043-7398 | |
| keywords | Solders | |
| keywords | Stress | |
| keywords | Drops | |
| keywords | Shear (Mechanics) | |
| keywords | Failure | |
| keywords | Fatigue life | |
| keywords | Fittings | |
| keywords | Low cycle fatigue AND Solder joints | |
| tree | Journal of Electronic Packaging:;1989:;volume( 111 ):;issue: 002 | |
| contenttype | Fulltext | |