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contributor authorH. D. Solomon
date accessioned2017-05-08T23:29:44Z
date available2017-05-08T23:29:44Z
date copyrightJune, 1989
date issued1989
identifier issn1528-9044
identifier otherJEPAE4-26108#75_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/105252
description abstractThis paper describes low cycle fatigue test run at −50°C, 35°C, 125°C, and 150°C on thin 60 Sn/40 Pb solder joints, tested in simple shear. The low cycle fatigue behavior was found to be a function of the criteria used to define the fatigue life. Different drops in the hysteresis load, measured when a constant plastic strain is being applied, was used to define failure. Not only was the magnitude of the fatigue life a function of the load drop definition for failure, it was also found that the Coffin-Manson low cycle fatigue exponent was a function of this definition. The choice of dependent variable for the curve fitting procedure used to calculate the Coffin-Manson exponent is also considered.
publisherThe American Society of Mechanical Engineers (ASME)
titleStrain-Life Behavior in 60/40 Solder
typeJournal Paper
journal volume111
journal issue2
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.3226525
journal fristpage75
journal lastpage82
identifier eissn1043-7398
keywordsSolders
keywordsStress
keywordsDrops
keywordsShear (Mechanics)
keywordsFailure
keywordsFatigue life
keywordsFittings
keywordsLow cycle fatigue AND Solder joints
treeJournal of Electronic Packaging:;1989:;volume( 111 ):;issue: 002
contenttypeFulltext


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