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    An Analysis of Shrinkage Porosity in Aluminum Ball Bonding Process

    Source: Journal of Electronic Packaging:;1989:;volume( 111 ):;issue: 003::page 199
    Author:
    L. J. Huang
    ,
    K. Ramakrishna
    ,
    P. S. Ayyaswamy
    ,
    I. M. Cohen
    DOI: 10.1115/1.3226534
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The thermal evolution of liquid and solid during the radially inward solidification of spherical balls of liquid has been studied by accounting for the increase in the density as phase transition occurs from liquid to solid. With this increase in density, the system geometry becomes that of a hollow sphere with a void at the center. We consider pure metals and binary alloys. For alloy solidification, the void begins to grow only after the outer surface reaches the solidus temperature. The temperature dependence of the thermophysical properties of the two phases is taken into account along with the natural convective and radiative loss to the ambient. The model has been applied to pure aluminum, Al – 1% Si, Al - 1% Mg, and Al - 2% Mg for a range of initial radii of the balls. From this study, we conclude that: (a) the volume fraction of the shrinkage void in the ball is independent of the initial radius for pure metal while it increases monotonically with initial radius for the binary alloys, and (b) for identical conditions, the voids are much smaller in alloys than in the pure metal.
    keyword(s): Aluminum , Bonding , Shrinkage (Materials) , Porosity , Metals , Alloys , Density , Temperature , Solidification , Geometry , Indium alloys AND Phase transitions ,
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      An Analysis of Shrinkage Porosity in Aluminum Ball Bonding Process

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    http://yetl.yabesh.ir/yetl1/handle/yetl/105242
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    contributor authorL. J. Huang
    contributor authorK. Ramakrishna
    contributor authorP. S. Ayyaswamy
    contributor authorI. M. Cohen
    date accessioned2017-05-08T23:29:43Z
    date available2017-05-08T23:29:43Z
    date copyrightSeptember, 1989
    date issued1989
    identifier issn1528-9044
    identifier otherJEPAE4-26110#199_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/105242
    description abstractThe thermal evolution of liquid and solid during the radially inward solidification of spherical balls of liquid has been studied by accounting for the increase in the density as phase transition occurs from liquid to solid. With this increase in density, the system geometry becomes that of a hollow sphere with a void at the center. We consider pure metals and binary alloys. For alloy solidification, the void begins to grow only after the outer surface reaches the solidus temperature. The temperature dependence of the thermophysical properties of the two phases is taken into account along with the natural convective and radiative loss to the ambient. The model has been applied to pure aluminum, Al – 1% Si, Al - 1% Mg, and Al - 2% Mg for a range of initial radii of the balls. From this study, we conclude that: (a) the volume fraction of the shrinkage void in the ball is independent of the initial radius for pure metal while it increases monotonically with initial radius for the binary alloys, and (b) for identical conditions, the voids are much smaller in alloys than in the pure metal.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleAn Analysis of Shrinkage Porosity in Aluminum Ball Bonding Process
    typeJournal Paper
    journal volume111
    journal issue3
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.3226534
    journal fristpage199
    journal lastpage206
    identifier eissn1043-7398
    keywordsAluminum
    keywordsBonding
    keywordsShrinkage (Materials)
    keywordsPorosity
    keywordsMetals
    keywordsAlloys
    keywordsDensity
    keywordsTemperature
    keywordsSolidification
    keywordsGeometry
    keywordsIndium alloys AND Phase transitions
    treeJournal of Electronic Packaging:;1989:;volume( 111 ):;issue: 003
    contenttypeFulltext
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    DSpace software copyright © 2002-2015  DuraSpace
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