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contributor authorL. J. Huang
contributor authorK. Ramakrishna
contributor authorP. S. Ayyaswamy
contributor authorI. M. Cohen
date accessioned2017-05-08T23:29:43Z
date available2017-05-08T23:29:43Z
date copyrightSeptember, 1989
date issued1989
identifier issn1528-9044
identifier otherJEPAE4-26110#199_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/105242
description abstractThe thermal evolution of liquid and solid during the radially inward solidification of spherical balls of liquid has been studied by accounting for the increase in the density as phase transition occurs from liquid to solid. With this increase in density, the system geometry becomes that of a hollow sphere with a void at the center. We consider pure metals and binary alloys. For alloy solidification, the void begins to grow only after the outer surface reaches the solidus temperature. The temperature dependence of the thermophysical properties of the two phases is taken into account along with the natural convective and radiative loss to the ambient. The model has been applied to pure aluminum, Al – 1% Si, Al - 1% Mg, and Al - 2% Mg for a range of initial radii of the balls. From this study, we conclude that: (a) the volume fraction of the shrinkage void in the ball is independent of the initial radius for pure metal while it increases monotonically with initial radius for the binary alloys, and (b) for identical conditions, the voids are much smaller in alloys than in the pure metal.
publisherThe American Society of Mechanical Engineers (ASME)
titleAn Analysis of Shrinkage Porosity in Aluminum Ball Bonding Process
typeJournal Paper
journal volume111
journal issue3
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.3226534
journal fristpage199
journal lastpage206
identifier eissn1043-7398
keywordsAluminum
keywordsBonding
keywordsShrinkage (Materials)
keywordsPorosity
keywordsMetals
keywordsAlloys
keywordsDensity
keywordsTemperature
keywordsSolidification
keywordsGeometry
keywordsIndium alloys AND Phase transitions
treeJournal of Electronic Packaging:;1989:;volume( 111 ):;issue: 003
contenttypeFulltext


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