Abstract: An analytical approach has been developed to evaluate the interfacial shear and peel stresses in multilayered thin stacks subjected to uniform temperature variation. The approach, which is based ...

Abstract: Failures in electronic packaging under thermal fatigue often result from cracking in solder joints due to creep/fatigue crack growth. A nonlinear, time-dependent finite element analysis was performed ...

Abstract: The plastic deformation kinetics of 95.5Sn4Cu0.5Ag solder joints were determined in monotonic loading shear over the temperature range of 25°–150°C using three types of tests: (a) constant ...

Abstract: A relatively simple numerical method was developed to determine the stress intensity factors of interfacial cracks in bimaterial systems. The method is based on the evaluation of crack tip ...

Abstract: A linear-elastic analytical model has been developed to describe the deformed geometry of a multi-layered stack assembly subject to thermal loading. The model is based on Timoshenko’s bimetal ...

Abstract: A solder joint specimen has been designed to determine the stress/strain hysteresis response and fracture behavior of 90 percent wtPb/10 percent wtSn solder alloy. The specimen consists of an ...

Abstract: Thermal fatigue of solder joints is critical to the performance and reliability of electronic components. It is well known that the fatigue life of solder joints is rather difficult to be ...

Abstract: When modeling the thermomechanical behavior of electronic packages, engineers often need to include the temperature dependence of coefficients of thermal expansion (CTE) of materials involved in ...

Abstract: Failures in electronic packages under thermal fatigue usually result from cracking in solder joints due to creep/fatigue crack growth. Understanding the stress/strain behavior of such solder joints ...