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RISDirect Concentration Approach of Moisture Diffusion and Whole-Field Vapor Pressure Modeling for Reflow Process—Part I: Theory and Numerical Implementation
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Moisture concentration is discontinuous at interfaces when two materials, which have different saturated moisture concentrations, are joined together. In order to perform moisture diffusion modeling ...
Direct Concentration Approach of Moisture Diffusion and Whole-Field Vapor Pressure Modeling for Reflow Process—Part II: Application to 3D Ultrathin Stacked-Die Chip Scale Packages
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In the present study, the direct concentration approach (DCA) and the whole-field vapor pressure model developed in Part I of this work (, 2009 “ Direct Concentration Approach of Moisture ...
Rapid Temperature Cycling (RTC) Methodology for Reliability Assessment of Solder Interconnection in Tape Ball Grid Array (TBGA) Assembly
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In this study, a thermoelectric cooler-based rapid temperature cycling (RTC) testing method was established and applied to assess the long term reliability of solder joints in tape ball grid ...
A New Creep Constitutive Model for Eutectic Solder Alloy
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In this study, a large number of creep tests were carried out to study the effect of stress level and testing temperature on the creep behavior of 63 Sn/37Pb solder in a systematic manner. ...
Creep Behavior and Deformation Mechanism Map of Sn-Pb Eutectic Solder Alloy
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In this study, a large number of creep tests were carried out using miniature specimens in order to investigate the creep behavior of 63Sn/37Pb eutectic solder alloy over a wide temperature ...
Erratum: “Effect of Temperature and Strain Rate on Mechanical Properties of 63Sn/37Pb Solder Alloy” [ASME J. Electron. Packag., 121, pp. 179–185]
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: [S1043-7398(00)01601-7]
Effect of Temperature and Strain Rate on Mechanical Properties of 63Sn/37Pb Solder Alloy
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In this study, tensile tests of 63Sn/37Pb solder were carried out at various strain rates from 10−5 s−1 to 10−1 s−1 over a wide temperature range from −40°C to 125°C to study the ...