| contributor author | X. Q. Shi | |
| contributor author | W. Zhou | |
| contributor author | H. L. J. Pang | |
| contributor author | Z. P. Wang | |
| date accessioned | 2017-05-09T00:02:13Z | |
| date available | 2017-05-09T00:02:13Z | |
| date copyright | March, 2000 | |
| date issued | 2000 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26178#74_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/123568 | |
| description abstract | [S1043-7398(00)01601-7] | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Erratum: “Effect of Temperature and Strain Rate on Mechanical Properties of 63Sn/37Pb Solder Alloy” [ASME J. Electron. Packag., 121, pp. 179–185] | |
| type | Journal Paper | |
| journal volume | 122 | |
| journal issue | 1 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.483136 | |
| journal fristpage | 74 | |
| identifier eissn | 1043-7398 | |
| keywords | Temperature | |
| keywords | Electrons | |
| keywords | Alloys | |
| keywords | Solders AND Mechanical properties | |
| tree | Journal of Electronic Packaging:;2000:;volume( 122 ):;issue: 001 | |
| contenttype | Fulltext | |