| contributor author | X. Q. Shi | |
| contributor author | W. Zhou | |
| contributor author | Q. J. Yang | |
| contributor author | H. L. J. Pang | |
| contributor author | Z. P. Wang | |
| date accessioned | 2017-05-09T00:07:12Z | |
| date available | 2017-05-09T00:07:12Z | |
| date copyright | June, 2002 | |
| date issued | 2002 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26203#85_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/126621 | |
| description abstract | In this study, a large number of creep tests were carried out to study the effect of stress level and testing temperature on the creep behavior of 63 Sn/37Pb solder in a systematic manner. Based on the dislocation controlled creep mechanism and Gibbs’ free-energy theory, a new creep constitutive model was proposed. The model was found to describe accurately the creep flow of the solder and to be capable of explaining the issues of stress and temperature dependent stress exponent and activation energy in the Arrhenius power-law creep model. Furthermore, the model was employed to predict accurately the long-term reliability of solder joints in a PBGA assembly. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | A New Creep Constitutive Model for Eutectic Solder Alloy | |
| type | Journal Paper | |
| journal volume | 124 | |
| journal issue | 2 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.1462624 | |
| journal fristpage | 85 | |
| journal lastpage | 90 | |
| identifier eissn | 1043-7398 | |
| keywords | Solders | |
| keywords | Stress | |
| keywords | Constitutive equations | |
| keywords | Creep | |
| keywords | Temperature | |
| keywords | Flow (Dynamics) | |
| keywords | Mechanisms AND Alloys | |
| tree | Journal of Electronic Packaging:;2002:;volume( 124 ):;issue: 002 | |
| contenttype | Fulltext | |