| contributor author | X. Q. Shi | |
| contributor author | H. L. J. Pang | |
| contributor author | Z. P. Wang | |
| contributor author | Q. J. Yang | |
| date accessioned | 2017-05-09T00:10:26Z | |
| date available | 2017-05-09T00:10:26Z | |
| date copyright | January, 2003 | |
| date issued | 2003 | |
| identifier issn | 0094-4289 | |
| identifier other | JEMTA8-27042#81_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/128524 | |
| description abstract | In this study, a large number of creep tests were carried out using miniature specimens in order to investigate the creep behavior of 63Sn/37Pb eutectic solder alloy over a wide temperature range from −40 to 150°C and stress range from 0.75 to 70 MPa. Based on dislocation and diffusion theories, two unified constitutive models were developed to describe the dislocation-controlled and diffusion-controlled creep behaviors observed. It was found that the two models accurately predict the experimental data. A deformation mechanism map was established for this eutectic solder alloy in order to interpret the creep mechanism under different temperature and loading conditions. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Creep Behavior and Deformation Mechanism Map of Sn-Pb Eutectic Solder Alloy | |
| type | Journal Paper | |
| journal volume | 125 | |
| journal issue | 1 | |
| journal title | Journal of Engineering Materials and Technology | |
| identifier doi | 10.1115/1.1525254 | |
| journal fristpage | 81 | |
| journal lastpage | 88 | |
| identifier eissn | 1528-8889 | |
| keywords | Creep | |
| keywords | Temperature | |
| keywords | Solders | |
| keywords | Stress | |
| keywords | Mechanisms | |
| keywords | Alloys | |
| keywords | Deformation AND Dislocations | |
| tree | Journal of Engineering Materials and Technology:;2003:;volume( 125 ):;issue: 001 | |
| contenttype | Fulltext | |