Abstract: Threedimensional (3D) chip stacking architecture is expected to reduce form factor, improve performance, and decrease power consumption in future microelectronics. High power density and nonuniform power distribution in ...

Abstract: This study investigates heat dissipation at carbon nanotube (CNT) junctions supported on silicon dioxide substrate using molecular dynamics simulations. The temperature rise in a CNT (∼top CNT) not making direct contact ...

Abstract: A major challenge in maintaining quality and reliability in today's microelectronics chips comes from the ever increasing levels of integration in the device fabrication, as well as from the high current densities. Transient ...

Abstract: The microstructure that lies within a continuum sometimes plays a very important role, and hence, mechanics associated with the microstructure cannot be disregarded during the study of elastodynamic problems in such a ...

Abstract: In the hydro power plants, mild steel pipes are used to transport river water from Dam to the turbine house. This water usually contains sand particles that are also transported through these pipelines that are observed ...

Abstract: In a microelectronic device, thermal transport needs to be simulated on scales ranging from tens of nanometers to hundreds of millimeters. High accuracy multiscale models are required to develop engineering tools for ...

Abstract: Thermoelectric generators (TEGs) can significantly improve the net power consumption and battery life of the low power mobile devices or high performance devices by generating power from their waste heat. Recent advancements ...

Abstract: Hotspots on a microelectronic package can severely hurt the performance and longterm reliability of the chip. Thermoelectric coolers (TECs) can provide sitespecific and ondemand cooling of hot spots in microprocessors. We ...

Abstract: Several studies have validated that diffusive Fourier model is inadequate to model thermal transport at submicron length scales. Hence, Boltzmann transport equation (BTE) is being utilized to improve thermal predictions ...

Abstract: One of the key challenges for the electric vehicle industry is to develop high-power-density electric motors. Achieving higher power density requires efficient heat removal from inside the motor. In order to improve thermal ...