Solving Nongray Boltzmann Transport Equation in Gallium NitrideSource: Journal of Heat Transfer:;2017:;volume( 139 ):;issue: 010::page 102701DOI: 10.1115/1.4036616Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Several studies have validated that diffusive Fourier model is inadequate to model thermal transport at submicron length scales. Hence, Boltzmann transport equation (BTE) is being utilized to improve thermal predictions in electronic devices, where ballistic effects dominate. In this work, we investigated the steady-state thermal transport in a gallium nitride (GaN) film using the BTE. The phonon properties of GaN for BTE simulations are calculated from first principles—density functional theory (DFT). Despite parallelization, solving the BTE is quite expensive and requires significant computational resources. Here, we propose two methods to accelerate the process of solving the BTE without significant loss of accuracy in temperature prediction. The first one is to use the Fourier model away from the hot-spot in the device where ballistic effects can be neglected and then couple it with a BTE model for the region close to hot-spot. The second method is to accelerate the BTE model itself by using an adaptive model which is faster to solve as BTE for phonon modes with low Knudsen number is replaced with a Fourier like equation. Both these methods involve choosing a cutoff parameter based on the phonon mean free path (mfp). For a GaN-based device considered in the present work, the first method decreases the computational time by about 70%, whereas the adaptive method reduces it by 60% compared to the case where full BTE is solved across the entire domain. Using both the methods together reduces the overall computational time by more than 85%. The methods proposed here are general and can be used for any material. These approaches are quite valuable for multiscale thermal modeling in solving device level problems at a faster pace without a significant loss of accuracy.
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contributor author | Vallabhaneni, Ajit K. | |
contributor author | Chen, Liang | |
contributor author | Gupta, Man P. | |
contributor author | Kumar, Satish | |
date accessioned | 2017-11-25T07:17:00Z | |
date available | 2017-11-25T07:17:00Z | |
date copyright | 2017/6/6 | |
date issued | 2017 | |
identifier issn | 0022-1481 | |
identifier other | ht_139_10_102701.pdf | |
identifier uri | http://138.201.223.254:8080/yetl1/handle/yetl/4234343 | |
description abstract | Several studies have validated that diffusive Fourier model is inadequate to model thermal transport at submicron length scales. Hence, Boltzmann transport equation (BTE) is being utilized to improve thermal predictions in electronic devices, where ballistic effects dominate. In this work, we investigated the steady-state thermal transport in a gallium nitride (GaN) film using the BTE. The phonon properties of GaN for BTE simulations are calculated from first principles—density functional theory (DFT). Despite parallelization, solving the BTE is quite expensive and requires significant computational resources. Here, we propose two methods to accelerate the process of solving the BTE without significant loss of accuracy in temperature prediction. The first one is to use the Fourier model away from the hot-spot in the device where ballistic effects can be neglected and then couple it with a BTE model for the region close to hot-spot. The second method is to accelerate the BTE model itself by using an adaptive model which is faster to solve as BTE for phonon modes with low Knudsen number is replaced with a Fourier like equation. Both these methods involve choosing a cutoff parameter based on the phonon mean free path (mfp). For a GaN-based device considered in the present work, the first method decreases the computational time by about 70%, whereas the adaptive method reduces it by 60% compared to the case where full BTE is solved across the entire domain. Using both the methods together reduces the overall computational time by more than 85%. The methods proposed here are general and can be used for any material. These approaches are quite valuable for multiscale thermal modeling in solving device level problems at a faster pace without a significant loss of accuracy. | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | Solving Nongray Boltzmann Transport Equation in Gallium Nitride | |
type | Journal Paper | |
journal volume | 139 | |
journal issue | 10 | |
journal title | Journal of Heat Transfer | |
identifier doi | 10.1115/1.4036616 | |
journal fristpage | 102701 | |
journal lastpage | 102701-8 | |
tree | Journal of Heat Transfer:;2017:;volume( 139 ):;issue: 010 | |
contenttype | Fulltext |