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    Multiscale Transient Thermal Analysis of Microelectronics

    Source: Journal of Electronic Packaging:;2015:;volume( 137 ):;issue: 003::page 31002
    Author:
    Barabadi, Banafsheh
    ,
    Kumar, Satish
    ,
    Sukharev, Valeriy
    ,
    Joshi, Yogendra K.
    DOI: 10.1115/1.4029835
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: In a microelectronic device, thermal transport needs to be simulated on scales ranging from tens of nanometers to hundreds of millimeters. High accuracy multiscale models are required to develop engineering tools for predicting temperature distributions with sufficient accuracy in such devices. A computationally efficient and accurate multiscale reduced order transient thermal modeling methodology was developed using a combination of two different approaches: “progressive zoominâ€‌ method and “proper orthogonal decomposition (POD)â€‌ technique. The capability of this approach in handling several decades of length scales from “packageâ€‌ to “chip componentsâ€‌ at a considerably lower computational cost, while maintaining satisfactory accuracy was demonstrated. A flip chip ball grid array (FCBGA) package was considered for demonstration. The transient temperature and heat fluxes calculated on the top and bottom walls of the embedded chip at the package level simulations are employed as dynamic boundary conditions for the chip level simulation. The chip is divided into ten function blocks. Randomly generated dynamic power sources are applied in each of these blocks. The temperature rise in the different layers of the chip calculated from the multiscale model is compared with a finite element (FE) model. The close agreement between two models confirms that the multiscale approach can predict temperature rise accurately for scenarios corresponding to different power sources in functional blocks, without performing detailed FE simulations, which significantly reduces computational effort.
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      Multiscale Transient Thermal Analysis of Microelectronics

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    contributor authorBarabadi, Banafsheh
    contributor authorKumar, Satish
    contributor authorSukharev, Valeriy
    contributor authorJoshi, Yogendra K.
    date accessioned2017-05-09T01:16:59Z
    date available2017-05-09T01:16:59Z
    date issued2015
    identifier issn1528-9044
    identifier otherep_137_03_031002.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/157691
    description abstractIn a microelectronic device, thermal transport needs to be simulated on scales ranging from tens of nanometers to hundreds of millimeters. High accuracy multiscale models are required to develop engineering tools for predicting temperature distributions with sufficient accuracy in such devices. A computationally efficient and accurate multiscale reduced order transient thermal modeling methodology was developed using a combination of two different approaches: “progressive zoominâ€‌ method and “proper orthogonal decomposition (POD)â€‌ technique. The capability of this approach in handling several decades of length scales from “packageâ€‌ to “chip componentsâ€‌ at a considerably lower computational cost, while maintaining satisfactory accuracy was demonstrated. A flip chip ball grid array (FCBGA) package was considered for demonstration. The transient temperature and heat fluxes calculated on the top and bottom walls of the embedded chip at the package level simulations are employed as dynamic boundary conditions for the chip level simulation. The chip is divided into ten function blocks. Randomly generated dynamic power sources are applied in each of these blocks. The temperature rise in the different layers of the chip calculated from the multiscale model is compared with a finite element (FE) model. The close agreement between two models confirms that the multiscale approach can predict temperature rise accurately for scenarios corresponding to different power sources in functional blocks, without performing detailed FE simulations, which significantly reduces computational effort.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleMultiscale Transient Thermal Analysis of Microelectronics
    typeJournal Paper
    journal volume137
    journal issue3
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.4029835
    journal fristpage31002
    journal lastpage31002
    identifier eissn1043-7398
    treeJournal of Electronic Packaging:;2015:;volume( 137 ):;issue: 003
    contenttypeFulltext
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian