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RISComparison of Single-Phase Convection in Additive Manufactured Versus Traditional Metal Foams
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Metal foams have been often used for thermal management due to their favorable characteristics including high specific surface area (SSA), high thermal conductivity, and low relative density. However, they are accompanied ...
Compact Model Based Microfluidic Controller for Energy Efficient Thermal Management Using Single Tier and Three Dimensional Stacked Pin Fin Enhanced Microgap
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Overcooling of electronic devices and systems results in excess energy consumption, which can be reduced by closely linking cooling requirements with actual power dissipation. A thermal modelbased flow rate controller for ...
Computational Fluid Dynamics Modeling of Flow Boiling in Microchannels With Nonuniform Heat Flux
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The computational fluid dynamics (CFD) modeling of boiling phenomena has remained a challenge due to numerical limitations for accurately simulating the two-phase flow and phase-change processes. In the present investigation, ...
Transient Heat Conduction in On-Chip Interconnects Using Proper Orthogonal Decomposition Method
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A major challenge in maintaining quality and reliability in today's microelectronics chips comes from the ever increasing levels of integration in the device fabrication, as well as from the high current densities. Transient ...
Two-Phase Heat Transfer and Flow Regimes in Pin Fin-Enhanced Microgaps—Effect of Pin Spacing
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: An experimental investigation of the flow boiling of dielectric refrigerant R245fa is conducted in microgaps with enhancement features. A silicon microgap of height 200 μm populated with pin fin arrays of diameter 150 μm ...
Transient Characterization of Hybrid Microfluidic Thermoelectric Cooling Scheme for Dynamic Thermal Management of Microprocessor
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Power dissipated by modern microprocessors is a function of time and continuously changes with the workload, giving rise to temporal hotspots of local areas with very high power dissipation. A hybrid cooling scheme has ...
Multiscale Transient Thermal Analysis of Microelectronics
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In a microelectronic device, thermal transport needs to be simulated on scales ranging from tens of nanometers to hundreds of millimeters. High accuracy multiscale models are required to develop engineering tools for ...
Review of Thermal Packaging Technologies for Automotive Power Electronics for Traction Purposes
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Due to its superior electrical and thermal characteristics, silicon carbide power modules will soon replace silicon modules to be mass-produced and implemented in all-electric and hybrid-electric vehicles (HEVs). Redesign ...
Two Phase Convective Cooling for Ultrahigh Power Dissipation in Microprocessors
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: We present results of modeling for the design of microgaps for the removal of high heat fluxes via a strategy of high mass flux, high quality, and twophase forced convection. Modeling includes (1) thermodynamic analysis ...
Hotspot Thermal Management With Flow Boiling of Refrigerant in Ultrasmall Microgaps
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: As integration levels increase in next generation electronics, high power density devices become more susceptible to hotspot formation, which often imposes a thermal limitation on performance. Flow boiling of R134a in two ...