Two Phase Convective Cooling for Ultrahigh Power Dissipation in MicroprocessorsSource: Journal of Heat Transfer:;2016:;volume( 138 ):;issue: 001::page 11501Author:Kottke, Peter A.
,
Yun, Thomas M.
,
Green, Craig E.
,
Joshi, Yogendra K.
,
Fedorov, Andrei G.
DOI: 10.1115/1.4031111Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: We present results of modeling for the design of microgaps for the removal of high heat fluxes via a strategy of high mass flux, high quality, and twophase forced convection. Modeling includes (1) thermodynamic analysis to obtain performance trends across a wide range of candidate coolants, (2) evaluation of worstcase pressure drop due to contraction and expansion in inlet/outlet manifolds, and (3) 1D reducedorder simulations to obtain realistic estimates of different contributions to the pressure drops. The main result is the identification of a general trend of improved heat transfer performance at higher system pressure.
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| contributor author | Kottke, Peter A. | |
| contributor author | Yun, Thomas M. | |
| contributor author | Green, Craig E. | |
| contributor author | Joshi, Yogendra K. | |
| contributor author | Fedorov, Andrei G. | |
| date accessioned | 2017-05-09T01:29:59Z | |
| date available | 2017-05-09T01:29:59Z | |
| date issued | 2016 | |
| identifier issn | 0022-1481 | |
| identifier other | ht_138_01_011501.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/161485 | |
| description abstract | We present results of modeling for the design of microgaps for the removal of high heat fluxes via a strategy of high mass flux, high quality, and twophase forced convection. Modeling includes (1) thermodynamic analysis to obtain performance trends across a wide range of candidate coolants, (2) evaluation of worstcase pressure drop due to contraction and expansion in inlet/outlet manifolds, and (3) 1D reducedorder simulations to obtain realistic estimates of different contributions to the pressure drops. The main result is the identification of a general trend of improved heat transfer performance at higher system pressure. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Two Phase Convective Cooling for Ultrahigh Power Dissipation in Microprocessors | |
| type | Journal Paper | |
| journal volume | 138 | |
| journal issue | 1 | |
| journal title | Journal of Heat Transfer | |
| identifier doi | 10.1115/1.4031111 | |
| journal fristpage | 11501 | |
| journal lastpage | 11501 | |
| identifier eissn | 1528-8943 | |
| tree | Journal of Heat Transfer:;2016:;volume( 138 ):;issue: 001 | |
| contenttype | Fulltext |