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contributor authorKottke, Peter A.
contributor authorYun, Thomas M.
contributor authorGreen, Craig E.
contributor authorJoshi, Yogendra K.
contributor authorFedorov, Andrei G.
date accessioned2017-05-09T01:29:59Z
date available2017-05-09T01:29:59Z
date issued2016
identifier issn0022-1481
identifier otherht_138_01_011501.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/161485
description abstractWe present results of modeling for the design of microgaps for the removal of high heat fluxes via a strategy of high mass flux, high quality, and twophase forced convection. Modeling includes (1) thermodynamic analysis to obtain performance trends across a wide range of candidate coolants, (2) evaluation of worstcase pressure drop due to contraction and expansion in inlet/outlet manifolds, and (3) 1D reducedorder simulations to obtain realistic estimates of different contributions to the pressure drops. The main result is the identification of a general trend of improved heat transfer performance at higher system pressure.
publisherThe American Society of Mechanical Engineers (ASME)
titleTwo Phase Convective Cooling for Ultrahigh Power Dissipation in Microprocessors
typeJournal Paper
journal volume138
journal issue1
journal titleJournal of Heat Transfer
identifier doi10.1115/1.4031111
journal fristpage11501
journal lastpage11501
identifier eissn1528-8943
treeJournal of Heat Transfer:;2016:;volume( 138 ):;issue: 001
contenttypeFulltext


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