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Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In honor of Richard Chu, a symposium on “Thermal Management of Electronic Systems,” was held at the ASME IMECE in Washington DC, in November 2003, where over 45 papers were presented. This ...
Experimental Analysis Model of an Active Cooling Method for 3D-ICs Utilizing Multidimensional Configured Thermoelectric Coolers
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Presently, stack dice are used widely as low-power memory applications because thermal management of 3D architecture such as high-power processors inherits many thermal challenges. Inadequate thermal ...
Thermoelectric Cooling Analysis Using Modified-Graphical-Method for Multidimensional-Heat-Transfer-System
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Comprehensive analysis of microelectronic cooling systems utilizing thermoelectric modules is time consuming because it involves solving many parametric equations, which require solving complex ...
Impact of TXV and Compressor in the Stability of a High-End Computer Refrigeration System
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The combination of increased power dissipation and increased packaging density has led to substantial increases in chip and module heat flux in high-end computers. The challenge is to limit the ...
Methodology for an Integrated (Electrical/Mechanical) Design of PWBA
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This paper describes a general methodology of how electrical circuit design data are mapped into an intermediate analyzable representation that supports the information requirement of several ...
Mixed Convection of Impinging Air Cooling Over Heat Sink in Telecom System Application
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The current numerical investigation will examine the effect of an impinging mixed convection air jet on the heat transfer rate of a parallel flat plate heat sink. A three-dimensional numerical ...
Optimization of Data Center Room Layout to Minimize Rack Inlet Air Temperature
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In a typical raised floor data center with alternating hot and cold aisles, air enters the front of each rack over the entire height of the rack. Since the heat loads of data processing ...
Multi-Objective Optimization to Improve Both Thermal and Device Performance of a Nonuniformly Powered Micro-Architecture
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Integration of different functional components such as level two (L2) cache memory, high-speed I/O interfaces, and memory controller has enhanced microprocessor performance. In this architecture, ...
Design Optimization and Reliability of PWB Level Electronic Package
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: As the electronic packaging industry develops technologies for fabrication of smaller, faster, economical and reliable products, thermal management and design play an important role. Temperature ...
Development of Analytical Model to a Temperature Distribution of a First Level Package With a Nonuniformly Powered Die
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Microprocessors continue to grow in capabilities, complexity, and performance. Microprocessors typically integrate functional components such as logic and level two cache memory in their architecture. ...