Abstract: Shear deformation of

Abstract: Demand for long-term reliability of electronic packaging has lead to a large number of studies on viscoplastic behavior of solder alloys. Various creep models for solder alloys have been proposed. ...

Abstract: Since the first identification of carbon nanotubes in 1991, more than 60,000 research papers have been published (with around 3500 papers just published in 2009), reporting findings on electrical, ...

Abstract: Strain gradient plasticity theories that have emerged during recent years to provide an explanation for size dependent behavior exhibited by some materials have also created a need for additional ...

Abstract: The unravelling of (10, 10) and (18, 0) single-walled carbon nanotubes (SWCNTs) is simulated using molecular dynamics simulations at different temperatures. Two different schemes are proposed to ...

Abstract: Thermomigration experiments were conducted to study the change in mechanical properties of 95.5Sn–4Ag–0.5Cu (SAC405) lead-free solder joint under high temperature gradients. This paper presents some ...

Abstract: A thermomechanical fatigue life prediction model based on the theory of damage mechanics is presented. The damage evolution, corresponding to the material degradation under cyclic thermomechanical ...

Abstract: The reliability of solder joints in electronic packaging is becoming more important as the ball grid array (BGA) develops rapidly into the most popular packaging technology. Thermal fatigue of ...

Abstract: Uniaxial tension of chiral graphene nanoribbons (GNR) with and without edge hydrogen passivation are simulated using molecular dynamics (MD) simulations to study their mechanical properties. The results demonstrate that ...