contributor author | Cemal Basaran | |
contributor author | Yujun Wen | |
contributor author | Ph.D. Candidate | |
date accessioned | 2017-05-09T00:09:53Z | |
date available | 2017-05-09T00:09:53Z | |
date copyright | September, 2003 | |
date issued | 2003 | |
identifier issn | 1528-9044 | |
identifier other | JEPAE4-26221#426_1.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/128205 | |
description abstract | The reliability of solder joints in electronic packaging is becoming more important as the ball grid array (BGA) develops rapidly into the most popular packaging technology. Thermal fatigue of solder joints has been a reliability concern in the electronic packaging industry since the introduction of surface mount technology (SMT). Microstructural coarsening (phase growth) is considered to be closely related to thermomechanical fatigue failure. Many researchers proposed coarsening models for bulk scale metals. But these models have never been verified for micron-scale actual BGA solder balls. In the present study, three different phase growth models are investigated experimentally on BGA solder balls in a real-life electronic package. Model simulations obtained from three models were compared against test data. The best performing model was chosen for finite element fatigue reliability studies based on continuum damage mechanics. | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | Coarsening in BGA Solder Balls: Modeling and Experimental Evaluation | |
type | Journal Paper | |
journal volume | 125 | |
journal issue | 3 | |
journal title | Journal of Electronic Packaging | |
identifier doi | 10.1115/1.1602707 | |
journal fristpage | 426 | |
journal lastpage | 430 | |
identifier eissn | 1043-7398 | |
keywords | Temperature | |
keywords | Solders | |
keywords | Modeling | |
keywords | Solder joints | |
keywords | Ball-Grid-Array packaging | |
keywords | Diffusion (Physics) | |
keywords | Fatigue | |
keywords | Creep | |
keywords | Reliability | |
keywords | Fatigue failure AND Metals | |
tree | Journal of Electronic Packaging:;2003:;volume( 125 ):;issue: 003 | |
contenttype | Fulltext | |