YaBeSH Engineering and Technology Library

    • Journals
    • PaperQuest
    • YSE Standards
    • YaBeSH
    • Login
    View Item 
    •   YE&T Library
    • ASME
    • Journal of Electronic Packaging
    • View Item
    •   YE&T Library
    • ASME
    • Journal of Electronic Packaging
    • View Item
    • All Fields
    • Source Title
    • Year
    • Publisher
    • Title
    • Subject
    • Author
    • DOI
    • ISBN
    Advanced Search
    JavaScript is disabled for your browser. Some features of this site may not work without it.

    Archive

    Coarsening in BGA Solder Balls: Modeling and Experimental Evaluation

    Source: Journal of Electronic Packaging:;2003:;volume( 125 ):;issue: 003::page 426
    Author:
    Cemal Basaran
    ,
    Yujun Wen
    ,
    Ph.D. Candidate
    DOI: 10.1115/1.1602707
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The reliability of solder joints in electronic packaging is becoming more important as the ball grid array (BGA) develops rapidly into the most popular packaging technology. Thermal fatigue of solder joints has been a reliability concern in the electronic packaging industry since the introduction of surface mount technology (SMT). Microstructural coarsening (phase growth) is considered to be closely related to thermomechanical fatigue failure. Many researchers proposed coarsening models for bulk scale metals. But these models have never been verified for micron-scale actual BGA solder balls. In the present study, three different phase growth models are investigated experimentally on BGA solder balls in a real-life electronic package. Model simulations obtained from three models were compared against test data. The best performing model was chosen for finite element fatigue reliability studies based on continuum damage mechanics.
    keyword(s): Temperature , Solders , Modeling , Solder joints , Ball-Grid-Array packaging , Diffusion (Physics) , Fatigue , Creep , Reliability , Fatigue failure AND Metals ,
    • Download: (554.8Kb)
    • Show Full MetaData Hide Full MetaData
    • Get RIS
    • Item Order
    • Go To Publisher
    • Price: 5000 Rial
    • Statistics

      Coarsening in BGA Solder Balls: Modeling and Experimental Evaluation

    URI
    http://yetl.yabesh.ir/yetl1/handle/yetl/128205
    Collections
    • Journal of Electronic Packaging

    Show full item record

    contributor authorCemal Basaran
    contributor authorYujun Wen
    contributor authorPh.D. Candidate
    date accessioned2017-05-09T00:09:53Z
    date available2017-05-09T00:09:53Z
    date copyrightSeptember, 2003
    date issued2003
    identifier issn1528-9044
    identifier otherJEPAE4-26221#426_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/128205
    description abstractThe reliability of solder joints in electronic packaging is becoming more important as the ball grid array (BGA) develops rapidly into the most popular packaging technology. Thermal fatigue of solder joints has been a reliability concern in the electronic packaging industry since the introduction of surface mount technology (SMT). Microstructural coarsening (phase growth) is considered to be closely related to thermomechanical fatigue failure. Many researchers proposed coarsening models for bulk scale metals. But these models have never been verified for micron-scale actual BGA solder balls. In the present study, three different phase growth models are investigated experimentally on BGA solder balls in a real-life electronic package. Model simulations obtained from three models were compared against test data. The best performing model was chosen for finite element fatigue reliability studies based on continuum damage mechanics.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleCoarsening in BGA Solder Balls: Modeling and Experimental Evaluation
    typeJournal Paper
    journal volume125
    journal issue3
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.1602707
    journal fristpage426
    journal lastpage430
    identifier eissn1043-7398
    keywordsTemperature
    keywordsSolders
    keywordsModeling
    keywordsSolder joints
    keywordsBall-Grid-Array packaging
    keywordsDiffusion (Physics)
    keywordsFatigue
    keywordsCreep
    keywordsReliability
    keywordsFatigue failure AND Metals
    treeJournal of Electronic Packaging:;2003:;volume( 125 ):;issue: 003
    contenttypeFulltext
    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian
     
    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian