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    A Creep Model for Solder Alloys

    Source: Journal of Electronic Packaging:;2011:;volume( 133 ):;issue: 004::page 44501
    Author:
    Yongchang Lee
    ,
    Cemal Basaran
    DOI: 10.1115/1.4005288
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Demand for long-term reliability of electronic packaging has lead to a large number of studies on viscoplastic behavior of solder alloys. Various creep models for solder alloys have been proposed. They range from purely empirical to mechanism based models where dislocation motion and diffusion processes are taken into account. In this study, most commonly used creep models are compared with the test data and implemented in ABAQUS to compare their performance in cycling loading. Finally, a new creep model is proposed that combines best features of many models. It is also shown that, while two creep models may describe the same material stress–strain rate curves equally well, they may yield very different results when utilized for cycling loading. One interesting observation of this study is that the stress exponent, n., also depends on the grain size.
    keyword(s): Creep , Alloys AND Solders ,
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      A Creep Model for Solder Alloys

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    http://yetl.yabesh.ir/yetl1/handle/yetl/145779
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    contributor authorYongchang Lee
    contributor authorCemal Basaran
    date accessioned2017-05-09T00:43:07Z
    date available2017-05-09T00:43:07Z
    date copyrightDecember, 2011
    date issued2011
    identifier issn1528-9044
    identifier otherJEPAE4-26319#044501_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/145779
    description abstractDemand for long-term reliability of electronic packaging has lead to a large number of studies on viscoplastic behavior of solder alloys. Various creep models for solder alloys have been proposed. They range from purely empirical to mechanism based models where dislocation motion and diffusion processes are taken into account. In this study, most commonly used creep models are compared with the test data and implemented in ABAQUS to compare their performance in cycling loading. Finally, a new creep model is proposed that combines best features of many models. It is also shown that, while two creep models may describe the same material stress–strain rate curves equally well, they may yield very different results when utilized for cycling loading. One interesting observation of this study is that the stress exponent, n., also depends on the grain size.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleA Creep Model for Solder Alloys
    typeJournal Paper
    journal volume133
    journal issue4
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.4005288
    journal fristpage44501
    identifier eissn1043-7398
    keywordsCreep
    keywordsAlloys AND Solders
    treeJournal of Electronic Packaging:;2011:;volume( 133 ):;issue: 004
    contenttypeFulltext
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
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