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    Damage Mechanics of Surface Mount Technology Solder Joints Under Concurrent Thermal and Dynamic Loading 

    Source: Journal of Electronic Packaging:;1999:;volume( 121 ):;issue: 002:;page 61
    Author(s): R. Chandaroy; C. Basaran
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: In the electronic industry, the dominant failure mode for solder joints is assumed to be thermal cycling. When semiconductor devices are used in vibrating environment, such as automotive and ...
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    Nonlinear Dynamic Analysis of Surface Mount Interconnects: Part II—Applications 

    Source: Journal of Electronic Packaging:;1999:;volume( 121 ):;issue: 001:;page 12
    Author(s): C. Basaran; R. Chandaroy
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Using the unified constitutive model and the finite element procedure presented in Part I (the preceding paper), a material nonlinear time domain dynamic analysis of a solder joint was studied ...
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    Nonlinear Dynamic Analysis of Surface Mount Interconnects: Part I—Theory 

    Source: Journal of Electronic Packaging:;1999:;volume( 121 ):;issue: 001:;page 8
    Author(s): C. Basaran; R. Chandaroy
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Solder joints are commonly used in surface mount technology microelectronics packaging. It is well known that the dominant failure mode for solder joints is thermal fatigue. When semiconductor ...
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    A Thermodynamic Framework for Damage Mechanics of Solder Joints 

    Source: Journal of Electronic Packaging:;1998:;volume( 120 ):;issue: 004:;page 379
    Author(s): C. Basaran; C.-Y. Yan
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Damage mechanics describes the degradation process that takes place in materials and structures. Traditionally, Coffin–Manson type empirical curves are used to determine the fatigue life. Damage ...
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    Stress Whitening Quantification of Thermoformed Mineral Filled Acrylics 

    Source: Journal of Engineering Materials and Technology:;2010:;volume( 132 ):;issue: 003:;page 31002
    Author(s): E. M. Gunel; C. Basaran
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Stress whitening problem in thermoformed alumina trihydrate (ATH) reinforced poly(methyl methacrylate) (PMMA) was studied. In situ heavy-gage thermoforming of acrylics was entirely replicated under ...
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    Thermomechanical Finite Element Analysis of Problems in Electronic Packaging Using the Disturbed State Concept: Part 1—Theory and Formulation 

    Source: Journal of Electronic Packaging:;1998:;volume( 120 ):;issue: 001:;page 41
    Author(s): C. Basaran; C. S. Desai; T. Kundu
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Accurate prediction of the thermomechanical cyclic behavior of joints and interfaces in semiconductor devices is essential for their reliable design. In order to understand and predict the behavior ...
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    Thermomechanical Finite Element Analysis of Problems in Electronic Packaging Using the Disturbed State Concept: Part 2—Verification and Application 

    Source: Journal of Electronic Packaging:;1998:;volume( 120 ):;issue: 001:;page 48
    Author(s): C. Basaran; C. S. Desai; T. Kundu
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The finite element procedure with the unified disturbed state modeling concept presented in Part I, Basaran et al. (1998), is verified here with respect to laboratory test results for Pb40/Sn60 ...
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    A Damage-Mechanics-Based Constitutive Model for Solder Joints 

    Source: Journal of Electronic Packaging:;2005:;volume( 127 ):;issue: 003:;page 208
    Author(s): C. Basaran; Y. Zhao; H. Tang; J. Gomez
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Sn-Pb eutectic solder alloy is extensively used in microelectronics packaging interconnects. Due to the high homologous temperature, eutectic Sn-Pb solder exhibits creep-fatigue interaction and ...
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    Failure Modes of Flip Chip Solder Joints Under High Electric Current Density 

    Source: Journal of Electronic Packaging:;2005:;volume( 127 ):;issue: 002:;page 157
    Author(s): C. Basaran; D. Frear; J. K. Lin; H. Ye; D. C. Hopkins
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The failure modes of flip chip solder joints under high electrical current density are studied experimentally. Three different failure modes are reported. Only one of the failure modes is caused ...
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