| contributor author | C. Basaran | |
| contributor author | R. Chandaroy | |
| date accessioned | 2017-05-08T23:59:23Z | |
| date available | 2017-05-08T23:59:23Z | |
| date copyright | March, 1999 | |
| date issued | 1999 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26171#12_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/122019 | |
| description abstract | Using the unified constitutive model and the finite element procedure presented in Part I (the preceding paper), a material nonlinear time domain dynamic analysis of a solder joint was studied for low cycle and high cycle fatigue. Thermal effects were not included in order to understand the dynamic behavior of a Pb40/Sn60 solder joint without noise-effects from thermal behavior. The latter decision was a result of observations reported in Steinberg (1988), that having in-phase or out-of-phase thermal loading in conjunction with vibrations makes a significant difference in the fatigue life. The study of fatigue under concurrent loading will be the subject of another paper. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Nonlinear Dynamic Analysis of Surface Mount Interconnects: Part II—Applications | |
| type | Journal Paper | |
| journal volume | 121 | |
| journal issue | 1 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.2792654 | |
| journal fristpage | 12 | |
| journal lastpage | 17 | |
| identifier eissn | 1043-7398 | |
| keywords | Dynamic analysis | |
| keywords | Surface mount packaging | |
| keywords | Solder joints | |
| keywords | Cycles | |
| keywords | Fatigue | |
| keywords | Noise (Sound) | |
| keywords | Temperature effects | |
| keywords | Constitutive equations | |
| keywords | Fatigue life | |
| keywords | Finite element analysis AND Vibration | |
| tree | Journal of Electronic Packaging:;1999:;volume( 121 ):;issue: 001 | |
| contenttype | Fulltext | |